論文
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Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints，K. S. Kim, S. H. Huh, and K. Suganuma，J. Alloy. Compd.，352(1-2), 226-236.，2003年01月，学術論文
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Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints，K. S. Kim, K. Suganuma, T. Shimozaki, and C.G. Lee，Materials Science Forum，439, 7-11，2003年01月，学術論文
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Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys，Y. S. Kim, K. S. Kim, C. W. Hwang, and K. Suganuma，J. Alloy. Compd.，352(1-2), 237-245，2003年01月，学術論文
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Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu，Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma，J. Elservier Science, Microelectron Reliab，2002年12月，学術論文
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Thermal fatigue damage of lead-free soldered through-hole circuit，Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma，Proc. 4th Pacific Rim International Conference on Advanced Materials and Processing, Hawaii.pp.1071-1074，2002年12月，会議報告/口頭発表
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高温保持によるSn-Zn系鉛フリーはんだとCu接合部の微細組織変化，金槿銖，金迎庵，菅沼克昭，中嶋英雄，エレクトロニクス実装学会J. Japan Institute of Electronics Packaging, vol. 5 pp.666-671，vol. 5 pp.666-671，2002年11月，学術論文
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Alloying Design for Lead-Free Soldering，K. Suganuma, Keun-Soo Kim and Chi-Won Hwang，International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka, Japan.pp.25-28，2002年11月，会議報告/口頭発表
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高温保持によるSn-Zn系鉛フリーはんだとCu接合部の微細組織変化，金 槿銖，金 迎奄，菅沼 克昭，中嶋 英雄，エレクトロニクス実装学会誌，5-7, 666-671，2002年11月，学術論文
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Carburization of TiAl Alloys by Reactive Plasma Process at Elevated Temperatures，Masahiro Inoue, Masanobu Nunogaki, Katsuaki Suganuma，2002年10月，会議報告/口頭発表
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Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy，K. Suganuma, T. Sakai, K.-S. Kim, Y. Takagi, J. Sugimoto and M. Ueshima，IEEE Trans. on Electronics Packaging Manufacturing, 25[4](2002), 257-261.，257-261，2002年10月，学術論文
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Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys，Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma，Materials Science and Engineering A, vol. 333 pp.106-114，vol. 333 pp.106-114，2002年08月，学術論文
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Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys，K. S. Kim, S. H. Huh, and K. Suganuma，Materials Science and Engineering A，333(August), 106-114，2002年08月，学術論文
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Mechanical behavior of reactively hot-pressed FeAl matrix composites with carbide particles at elevated temperatures，Masahiro Inoue, Katsuaki Suganuma，Journal of Materials Science Letters，2002年07月，学術論文
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Degradation mechanism of Ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure，M. Yamashita and K. Suganuma，journal of electronic materials pp.551-556，pp.551-556，2002年06月，学術論文
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Joining reliability of Sn-Ag-Cu series solder alloys，Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma，International Conference on Electronics Packaging (ICEP), Tokyo.pp.89-92，2002年04月，会議報告/口頭発表
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Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy，K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto, and M. Ueshima，IEEE Trans. Elec. Pack. Manu.，25-4, 257-261，2002年04月，学術論文
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Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder，Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma，Materials Transactions, JIM, vol. 43 pp.239-245，vol. 43 pp.239-245，2002年02月，学術論文
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Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder，S. H. Huh, K. S. Kim, and K. Suganuma，Materials Transactions, JIM，43-2, 239-245，2002年02月，学術論文
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High temperature stability of lead-free soldering interface，K.Suganuma and C.W.Hwang，Proc. Electronics Goes Green 2000+, ed. By H. Reighl and H.Griese, VDE Verlag, (2000), 67-72.，67-72，2002年01月，会議報告/口頭発表
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Structural characterization of the metal/glass interface in bioactive glass coatings on Ti-6Al-4V，T. Oku, K. Suganuma, L. R. Wallenberg, A. P. Tomsia, J. M. Gomez-Vega, E. Saiz，J. Mater. Sci. Mater. Med., Vol. 12, pp. 413-417.，Vol. 12, pp. 413-417，2001年12月，学術論文
