School personnel information

写真b

TAKAHASHI Yasuo


Keyword

Eco-process, Eco-design, Electronics packaging, Car electronics, Low Environmental Burden

URL

http://www24.casi.osaka-u.ac.jp

Organization 【 display / non-display

  • 1996.06.01 - 2003.12.31, Joining and Welding Research Institute, Associate Professor

  • 2004.01.01 - 2004.03.31, Cooperative Research Center for Advanced Science and Technology, Professor

  • 2004.04.01 - 2011.03.31, Center for Advanced Science and Innovation, Professor

  • 2011.04.01 - 2016.03.31, Joining and Welding Research Institute, Professor

  • 2016.04.01 - , Joining and Welding Research Institute, Specially Appointed Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1976.03
Osaka University Graduate School, Division of Engineering  Completed 1978.03
Osaka University Graduate School, Division of Engineering  Completed 1981.03

Employment Record 【 display / non-display

Osaka University,JWRI, Assosiate Professor 1991.05 - 2003.12
Collaborative Research Center for Advanced and Technology, Osaka University, Professor 2004.01 - 2004.03
Osaka University, Center for Advanced Science and Innovation (CASI), Professor 2004.04 - 2011.03
Joining and Welding Research Institute, OSaka University 2011.04 -

Research topics 【 display / non-display

  • Eco electronics packaging is mainly carried out. We also study the interconnection and bonding for IGBT for driving controlling eco hybrid car.We study the formation mechanism of interconnection of nest genaration environmentally friendly electronic devices. We are developing Pressureless and heatless room temperature bonding of dream like joining for the 21 century space age.
    Material processing and microstructure control-related, Metals production and resources production-related

Academic Society Membership 【 display / non-display

  • Smart Process Society

  • Japan Institute of Electronics Packaging

 

Academic Papers 【 display / non-display

  • In-Situ Observation of Adhesion Behavior during Ultrasonic Al Ribbon Bonding., Yasuo Takahashi, Kazumasa Takashima, Kouta Misawa Yusuke Takaoka, MDPI Appl. Sci. 2019, 9,,2019,9, 1835 (2019) 1-14., 2019.05, Papers

  • Ternary Ti-SiC alloy film formation on GaN and contact proerties, Y. Takahashi, M. Arai, M. Maeda, Ceramic International,45, (7), Part B, pp. 9359-9362, 2019.05, Papers

  • Performance Boost for Mg-Air Batteries Based on Felt Separators and Composite Cathodes, Zhonghao Heng, Shigeaki Uchida, Keijirou Itakura and Yasuo Takahashi, Proceeding of 25th Symposium on Microjoining and Assembly Technology in Electronics (MATE 2019),25 (2019) 379-382., 2019.01, International Conference(Proceedings)

  • Study of Improvement of Power and Stability of Magnesium Air Battery - Influence of Cathode Materials and Structures on Battery Properties., Keijirou Itakura, Takahiro Tsutsui, Zhonghao Heng, Hirohisa Hiraki, Shigeaki Uchida and Yasuo Takahaahi, Journal of Smart Processing,7, 2 (2019) 65-72., 2019.01, Papers(In Japanese)

  • Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding, Y.Takahashi, H.Fukuda, Y.Yoneshima, H.Kitamura, M.Maeda, Journal of Electronic Packaging,139, 41010 (2017) 1-13., 2017.11, Papers

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Books 【 display / non-display

  • Special, Microjoining and nanojoininig, Yasuo Takahashi, Woodhead Publishing Limited, ISBN, 978-1-84569-179-0, 2008.03

Patents / Utility models / Designs 【 display / non-display

  • Japan, Diffusion bonding metal matrix and its manufacturing method, TAKAHASHI Yasuo, P3720973(Registration), 1998.03, 2005.09

  • United States, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE, SUGIMOTO Masahiro; SEKI, Akinori; KAWAHASHI Akira; TAKAHASHI, Yasuo; MAEDA, Masakatsu, PCT/JP2010/065013(Application), 2010.09

  • United States, OHMIC ELECTRODE AND METHOD OF FORMING THE SAME, Seki A.; Sugimoto, M.; Kawahashi, A.; Takahashi, Y.; Maeda, M., PCT/IB2010/000161(Application), 2010.01

  • United States, Method of Forming an Ohmic Contact on a P-Type 5H-SiC Substrate, MAEDA Masakatsu, TAKAHASHI Yasuo, et al., US 8,008,180 B2(Registration), 2008.03, 2011.08

  • United States, METHOD OF FORMING AN OHMIC CONTACT ON A P-TYPE 4H-SiC SUBSTRATE, US12/530,901(Publication), 2008.03

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Awards 【 display / non-display

  • ASME Journal of Electronic Packaging Best Paper of the Year Award 2018, Y.Takahashi, H.Fukuda, Y.Yoneshima, H.Kitamura, and M.Maeda, ASME, 2018.08

  • Fellow of Japan Welding Society, Yasuo TAKAHASHI, Japan Welding Society, 2010.04

  • Japan Welding Society Achievement Award, Takahashi Yasuo, Japan Welding Society, 2008.04

  • Meritorial Awaord of Microjoining, TAKAHASHI Yasuo, Japan Welding Sciety, Committee of Microjoining, 2006.05

  • Paper award of high temperature Society of Japan in 1996, Yasuo TAkahashi, High Temperature Society of Japan, 1997.05

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