School personnel information

写真b

YASUDA Kiyokazu


Keyword

Dissimilar materials joining, Microelectronic materials, Smart micro processing

Mail Address

Mail Address

Laboratory Phone number

+81-6-6879-4737

Laboratory Fax number

+81-6-6879-7570

URL

http://www.mapse.eng.osaka-u.ac.jp/

Gender

Male

Organization 【 display / non-display

  • 1998.04.01 - 2005.02.28, Graduate School of Engineering, Research Assistant

  • 2005.03.01 - 2005.03.31, Graduate School of Engineering, Associate Professor

  • 2005.04.01 - 2009.03.31, Division of Materials and Manufacturing Science, Graduate School of Engineering, Associate Professor

  • 2012.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Associate Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated Bc. of Engineering 1986.03
Osaka University Graduate School, Division of Engineering  Completed Ms. of Engineering 1988.03
Osaka University Graduate School, Division of Engineering  Doctor (Engineering) 2001.03

Employment Record 【 display / non-display

Osaka University, Assistant Professor 1988.04 - 1997.03
Osaka University (Graduate School), Assistant Professor 1997.04 - 2004.06
Osaka University (Graduate School), Assistant Professor (Lecturer) 2004.07 - 2005.02
Osaka University (Graduate School), Associate Professor 2005.02 - 2009.03
Nagoya University Associate Professor 2009.04 - 2012.03
Osaka University (Graduate School), Associate Professor 2012.04 -
Nagoya University Guest Scholor (National Composite Center) 2017.04 -

Research topics 【 display / non-display

  • Development of Micro Systems by Biomimetic Interface Materials
    Electron device and electronic equipment-related, Electric and electronic materials-related, Biofunction and bioprocess engineering-related

  • Interconnection in Electronics Packaging using Self-Organization Mechanizm
    Electron device and electronic equipment-related, Nanomaterials-related, Metals production and resources production-related, Material processing and microstructure control-related, Thin film/surface and interfacial physical properties-related

  • Advanced Direct Joining of Carbon Related Composites and Metals by Electromagnetic Processing
    Material processing and microstructure control-related, Structural materials and functional materials-related, Composite materials and interfaces-related, Metallic material properties-related

  • Dissimilar Materials Joining of Super Engineering Plastics and Lightweight Metals
    Structural materials and functional materials-related, Material processing and microstructure control-related, Composite materials and interfaces-related, Manufacturing and production engineering-related

  • Function Control of Metal Nanoparticles-Polymer Interface by Laser-Produced Plasma Extreme Ultraviolet Light
    Material processing and microstructure control-related, Structural materials and functional materials-related, Metallic material properties-related, Electric and electronic materials-related

Academic Society Membership 【 display / non-display

  • TMS (The Minerals, Metals & Materials Society)

  • MRS-J (The Materials Research Society of Japan)

  • IEEE EPS (Electronics Packaging Society)

  • IEEE EDS (Electron Devices Society)

  • The Japan Society of Applied Physics (JSAP)

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Academic Papers 【 display / non-display

  • Laser metal bumping with SUS316L molten powder jet for steel / carbon fiber reinforced thermoplastics joint, K. Yasuda, Y. Uchida, R. Tamura, T. Hara, Y. Sato and M. Tsukamoto, Proc. the 8th International Congress on Laser Advanced Materials Processing (LAMP2019),Vol. 8, #19-01, 2019.09, International Conference(Proceedings)

  • Ultrasonic Bonding Technology for Micro System Integration, YASUDA Kiyokazu, Journal of The Japan Institute of Electronics Packaging,22(5) 395-399, 2019.08, Review Papers(In Japanese)

  • Ultrasonic Joining of Carbon Fiber Reinforced Thermoplastic and Ti Alloy, Rennosuke Tamura and Kiyokazu Yasuda, Proc. 2018 IEEE CPMT Symposium Japan (ICSJ2018),pp. 135-138, 2018.11, International Conference(Proceedings)

  • Nano-Modified Metal Bonding to Advanced Polymers for Automotive Systems, Kiyokazu Yasuda,International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT2018), 2018.10, International Conference(Non Proceeding)

  • Creation and Functional Control of Metal Nanoparticle-Polymer Interface by Laser Plasma EUV Light Excitation, Kiyokazu Yasuda, Nozomi Tanaka, Nao Wada, and Hiroaki Nishimura, Proc. of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 535-538, 2018.04, International Conference(Proceedings)

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Books 【 display / non-display

  • Special, Advanced medical engineering, Y. Baba, et al, Nagoya University, ISBN, 978-4-86431-159-5 C3047, 2013.03

  • Special, Practical Programming by Fortran90/95, Kiyokazu Yasuda, et al, Osaka University Press, ISBN, 978-4-87529-473-7 C3004, 2014.03

Patents / Utility models / Designs 【 display / non-display

  • Japan, Joining Method of Electrodes and Assembly Method of Semiconductor Devices, Kozo FUJIMOTO, Kiyokazu YASUDA, Jong-Min KIM, 特許第3769688号(Registration), 2003.10, 2006.02

  • United States, Method of interconnecting terminals and method for mounting semiconductor device, Fujimoto Kozo, Yasuda Kiyokazu, Kim Jong-Min, US 2007/0001313(Registration), 2006.08, 2007.01

  • Korea Republic of, Method of interconnecting terminals and method for mounting semiconductor device, Fujimoto Kozo, Yasuda Kiyokazu, Kim Jong-Min, KR2005/0094478(Registration), 2005.08

  • Europe, METHOD FOR INTERCONNECTING TERMINALS AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE (EP1615263), FUJIMOTO KOZO, YASUDA KIYOKAZU, KIM JONG-MIN, EP1615263(Registration), 2004.04, 2006.01

  •  , Method for Interconnecting Terminals and Method for Mounting Semiconductor Device (CN1820361), Kozo Fujimoto, Kiyokazu Yasuda, Jong-Min Kim, CN1820361(Registration), 2004.02, 2006.08

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Awards 【 display / non-display

  • Best Paper Award of Visual-JW 2014, Kiyokazu YASUDA, Joining and Welding Research Institute, Osaka University, 2014.11

  • JIEP Poster Award, Koushi Ota, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto, 2010.05

  • Best poster award of RAMM & ASMP 2009, Kiyokazu Yasuda, School of Materials & Mineral Resources Engineering (SMMRE) USM, 2009.06

  • MES2007 Best Paper Aword, Kousi Ohta, Masao Toya, Shinichi Motoshige, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto, Institute of Electronics Packaging, 2008.09

  • IEEE IEMT2006 Best Paper Awards, Kiyokazu Yasuda, Katsumi Taniguchi, Tomoaki Goto, Michiya Matsushima, Kozo Fujimoto, IEEE(Institute of Electrical and Electronics Engineers),CPMT, 2006.11

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Lecture / Exhibition 【 display / non-display

  • International Microelectronics, Packaging, Assembly and Circuits Technology conference (iMPACT2015), Spontaneous Micro Interconnection Technology for Low-Cost 3D Packaging (Invited talk), 2015.10

  • 43rd International Electronic Circuits Exhibition, Improvement of the Adhesive Properties of Self-Restoring Sheet Materials by the Low Pressure Plasma Treatment, 2013.06

  • Research Seminar of INHA University, Heterogeneous Micro Electro-Mechanical Interconnects Structure Evolved by Self-Assembly Process, 2012.01

  • 41st International Electronic Circuits Exhibition, Gang Self-Formation Process of Micro Metal Bumps by Surface Tension Effects, 2011.06

Conference management 【 display / non-display

  • International Conference, 2019 International Conference on Electronics Packaging (ICEP2019), Technical Program Committee, 2019.04

  • International Conference, IEEE CPMT Symposium Japan 2018, General Chair, 2018.11

  • Other, Kansai Workshop 2018, Organizing Comittee Chair, 2018.07

  • International Conference, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Technical Program Committee, 2018.04

  • International Conference, IEEE CPMT Symposium Japan 2017, Vice Chair, 2017.11

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Outside Activity Management 【 display / non-display

  • Academic society, The Japan Institute of Electronics Packaging, executive director, 2017.04 - 2019.03

  • Academic society, The Japan Institute of Electronics Packaging, educational project comittee chair, 2017.04 - 2019.03

  • Academic society, The Japan Institute of Electronics Packaging, Vice branch chair of Kansai chapter, 2016.04 -

  • Academic society, JIEP, Board member of Kansai chapter, 2013.04 -

  • Academic society, IEICE, Editorial board member, 2009.01 - 2009.11