School personnel information

写真b

HIROSE Akio


Keyword

Intelligent Materials Processing for Manufacturing

Mail Address

Mail Address

URL

http://www.mapse.eng.osaka-u.ac.jp/w2/

Gender

Male

Organization 【 display / non-display

  • 1998.04.01 - 2005.03.31, Graduate School of Engineering, Associate Professor

  • 2005.04.01 - 2006.03.31, Division of Materials and Manufacturing Science, Graduate School of Engineering, Associate Professor

  • 2006.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1979.03
Osaka University Graduate School, Division of Engineering  Completed 1981.03

Employment Record 【 display / non-display

professor 2006.04 -

Research topics 【 display / non-display

  • Micro Joining
    Material processing and microstructure control-related

  • Joining of Dissimilar Materilas
    Material processing and microstructure control-related

  • Laser Welding and Processing of Materials
    Material processing and microstructure control-related

  • Microfabrication
    Structural materials and functional materials-related, Material processing and microstructure control-related

Academic Society Membership 【 display / non-display

  • Japan Welding Society

  • The Japan Institute of Metals

  • The Society of Materials Science, Japan

  • Japan Laser Processing Society

  • The Iron and Steel Institute of Japan

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Academic Papers 【 display / non-display

  • High-frequency linear friction welding of aluminum alloys to stainless steel, Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose, Journal of Materials Processing Technology,Vol.269, 45-51, 2019.07, Papers

  • Thermal fatigue properties of ultrasonic bonded copper joints, 26. Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Applied Sciences,9, 1556 (2019), 2019.04, Papers

  • Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Journal of Electronic Materials,Vol. 48, Issue 6, pp. 3699-3712, 2019.03, Papers

  • Evolution of transient liquid-phase sintered Cu–Sn skeleton microstructure during thermal aging, Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Applied Science,9(1) 157, 2019.01, Papers

  • Bonding through novel solder-metallic mesh composite design, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Materials & Design,Vol.160, pp.475-485, 2018.12, Papers

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Books 【 display / non-display

  • Special, Progress in Advanced Structural and Functional Materials Design, T. Sano and A. Hirose, Springer, ISBN, 978-4-431-54063-2, 2012.11

  • Special, Microjoining and Nanojoining, Akio Hirose et al., Woodhead Publishing Limited, ISBN, 978-1-84569-179-0, 2008.03

  • Special, Novel Materials Processing by Advanced Electromagnetic Energy Sources, Akio Hirose et al., ELSEVIER, 2005.05

  • Special, "Application of Laser Surface Annealing to Improve the Resistance of Inconel 718 to Hydrogen Embrittlement" in "Recent Research and Development of Materials Science and Engineering", Kojiro F. Kobayashi, Transworld Research Network,Kerala, India, 2003.09

  • Special, Welding and Joining Handbook, Akio Hirose, Maruzen, 2003.06

Patents / Utility models / Designs 【 display / non-display

  • Japan, Joining Method and Joints, Naoaki Ogure, Yusuke Chikamori, Kojiro F. Kobayashi and Akio Hirose, WO 2005/095040(Registration), 2005.03

  • Japan, Joining Methods of Different Materials, Kojiro F.Kobayashi, Akio Hirose, Nariyuki Nakagawa,Kenji Miyamoto, Minoru Kasukawa, 特願2004-373381(Registration), 2004.12

  • Japan, Joining Methods of Different Materials, Kojiro F.Kobayashi, Akio Hirose, Kenji Miyamoto, Nariyuki Nakagawa, Minoru Kasukawa, Tetuji Morita, 特願2004-373400(Registration), 2004.12

  • Japan, Joining Methods of Different Materials, KOjiro F.Kobayashi, Akio Hirose, Minoru Kasukawa, Nariyuki Nakagawa, Kenji Miyamoto, Masayuki Inoue, 特願2004-373389(Registration), 2004.12

  • Japan, Joining Method and Joints, Naoaki Kogure, Yusuke Chikamori, Kojiro F. Kobayashi, Akio Hirose, 特願2004-102774(Registration), 2004.03

Awards 【 display / non-display

  • Mate 2017 Excellent Paper Award, 2017.02

  • Fellow of Japan Welding Society, Akio Hirose, Japan Welding Society, 2013.04

  • Osaka University Achievement Awards, Akio Hirose, Osaka University, 2011.07

  • The Japan Institute of Metals, Technical Development Award, T. Morita, Y. Yasuda, E. Ide and A. Hirose, The Japan Institute of Metals, 2010.09

  • International Conference on Electronics Packaging 2009 Outstanding Technical Paper Award, N.TAKEDA, H. TATSUM, Y. AKADA, T. OGURA, E. IDE, T. MORITA and A. HIROSE, Japan Institute of Electronics Packaging, 2010.04

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Conference management 【 display / non-display

  • International Conference, 4th International Conference on Nanojoining and Microjoining 2018, Conference Chair, 2018.12

  • International Conference, Thermec 2013, Executive COMMITTEE, 2013.12

  • International Conference, International Conference on Nanojoining and Microjoining, Conference Co-Chair, 2012.12