School personnel information

写真b

FUKUMOTO Shinji


Keyword

Microjoining, Electronic packaging, Resistance welding, Microstructure, Friction welding

Gender

Male

Organization 【 display / non-display

  • 2009.05.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Associate Professor

Education 【 display / non-display

Osaka University Graduate School, Division of Engineering  Completed 1995.03

Employment Record 【 display / non-display

Himeji Institute of Technology 1995.04 - 2009.04

Academic Society Membership 【 display / non-display

  • Japan Friction Welding Association

  • The Japan Institute of Light Metals

  • The Japan Institute of Metals

  • Japan Welding Society

 

Academic Papers 【 display / non-display

  • Proposal of Evaluation Method and Influencing Factors for Solder Wettability in Resin, Yosuke MIZOKAMI, Shinji FUKUMOTO, Michiya MATSUSHIMA, Minoru UESHIMA, Daisuke MINAKUCHI, Kozo FUJIMOTO, Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics,24 279-284, 2018.01, Conference Report / Oral Presentation (In Japanese)

  • Self-Organization Packaging Using Thermoset-Thermoplastic Hybrid Resin, Shinji FUKUMOTO, Yosuke MIZOKAMI, Keisuke YOSHIDA, Yusuke UENO, Michiya MATSUSHIMA, Takeshi KAN, Minoru UESHIMA, Daisuke MINAKUCHI, Kozo FUJIMOTO, Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics,24 273-278, 2018.01, Conference Report / Oral Presentation (In Japanese)

  • Effect of Compositions of Binder Resin on Cross-Sectional Shape and Electric Characteristics of Additive Patterned Wire, Youngbo LEE, Shinji FUKUMOTO, Yoshihiro KASHIBA, Michiya MATSUSHIMA, Kozo FUJIMOTO, Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics,24 155-162, 2018.01, Conference Report / Oral Presentation (In Japanese)

  • Effect of Stress Gradient on Heat Cycle Fatigue Prediction of Solder Joints by Three-point Bending Test, Kei ENDO, Michiya MATSUSHIMA, Shinji FUKUMOTO, Hiroaki HOKAZONO, Kozo FUJIMOTO, Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics,24 115-120, 2018.01, Conference Report / Oral Presentation (In Japanese)

  • Solid-Liquid Reaction Diffusion Bonding Using Low Melting Point Metal Thin Film between Copper Electrodes -Formation of Defects in Bond Layer-, Yuto WATANABE, Shinji FUKUMOTO, Michiya MATSUSHIMA, Kozo FUJIMOTO, Proceedings of the 24th Symposium on Microjoining and Assembly Technology in Electronics,24 25-30, 2018.01, Conference Report / Oral Presentation (In Japanese)

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Books 【 display / non-display

  • Special, Microjoining and Assembly Technology for Electronics, Kozo Fujimoto et. al., In Tech Information S.C.Co., Ltd, ISBN, 978-4-915957-88-8 C3053, 2012.07