School personnel information

写真b

FUJIMOTO Kouzou


Keyword

Micro system, Intelligent process

Mail Address

Mail Address

URL

http://www5.mapse.eng.osaka-u.ac.jp/index.html

Gender

Male

Organization 【 display / non-display

  • 1998.04.01 - 2002.03.31, Graduate School of Engineering, Associate Professor

  • 2002.04.01 - 2005.03.31, Graduate School of Engineering, Professor

  • 2005.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Professor

  • 2016.04.01 - , Center for Education in Liberal Arts and Sciences

  • 2018.04.01 - , Center for Education in Liberal Arts and Sciences

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1978.03
Osaka University Graduate School, Division of Engineering  Completed 1980.03

Research topics 【 display / non-display

  • Electron device and electronic equipment-related

  • Electron device and electronic equipment-related

  • Mechanics of materials and materials-related

  • Electron device and electronic equipment-related

  • Material processing and microstructure control-related

 

Academic Papers 【 display / non-display

  • Reliabirity Evaluation of Soldered Joints under Multiple Environments, Kozo FUJIMOTO, Journal of the JAPAN WELDING SOCIETY,Vol.80, No.4, pp.299-303, 2011.06, Review Papers(In Japanese)

  • Quality Improvement of GaAs Chips Die-Bonding Using AuSn Solder with Interface Reaction Control, Junji FUJINO, Masayasu ITO, Hiroo SAKAMOTO, Akiyoshi SAWAI, and Kozo FUJIMOTO, The IEICE Transactions on Electronics,Vol. J91-C, No.11, pp.635-644, 2008.11, Papers(In Japanese)

  • Strain Rate Effects on Failure Modes and Fracture Life under Impact Loading for Mounting Board, Masatoshi NAKAMURA, Toshimasa NISIHARA, Kozo FUJIMOTO, Proceedings of the 14th Symposium on Microjoining and Assembly Technology in Electronics,Vol.14, pp.149-154, 2008.02, Papers(In Japanese)

  • The Material Deterioration and Microstructure Changes by the thermal Load and the Effects on the Fatigue Life against Vibration Load, Michiya Matsushima, Yuki Shishihara, Hirotaka Matsunami, Shinji Fukumoto, Kozo Fujimoto, ICEP2010 Proceedings,pp.561-566, 2010.05, International Conference(Proceedings)

  • Au-Si Eutectic Bonding for Wafer Level Hermetic High Vacuum Packaging, Yoichi NISHIJIMA, Yoshimaru SANAGAWA, Yoshiyuki TAKEGAWA, Masao KUBO, Hirotaka MATSUNAMI, Kozo FUJIMOTO, Proceedings of the 16th Symposium on Microjoining and Assembly Technology in Electronics,Vo.16, pp.445-450, 2010.02, Papers(In Japanese)

display all >>

Books 【 display / non-display

  • Special, Microjoining and Assembly Technology for Electronics, Kozo Fujimoto et. al., In Tech Information S.C.Co., Ltd, ISBN, 978-4-915957-88-8 C3053, 2012.07

Patents / Utility models / Designs 【 display / non-display

  • United States, Method of interconnecting terminals and method for mounting semiconductor device, Fujimoto Kozo, Yasuda Kiyokazu, Kim Jong-Min, US 2007/0001313(Registration), 2006.08, 2007.01

  • Korea Republic of, Method of interconnecting terminals and method for mounting semiconductor device, Fujimoto Kozo, Yasuda Kiyokazu, Kim Jong-Min, KR2005/0094478(Registration), 2005.08

  • Europe, METHOD FOR INTERCONNECTING TERMINALS AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE (EP1615263), FUJIMOTO KOZO, YASUDA KIYOKAZU, KIM JONG-MIN, EP1615263(Registration), 2004.04, 2006.01

  •  , Method for Interconnecting Terminals and Method for Mounting Semiconductor Device (CN1820361), Kozo Fujimoto, Kiyokazu Yasuda, Jong-Min Kim, CN1820361(Registration), 2004.02, 2006.08

  •  , Method for Interconnecting Terminals and Method for Mounting Semiconductor Device (WO2004070827), Kozo Fujimoto, Kiyokazu Yasuda, Jong-Min Kim, WO/2004/070827(Registration), 2004.02, 2004.08

display all >>

Awards 【 display / non-display

  • Excellent Paper Award, Kozo Fujimoto, Japan Welding Society, 2003.04

  • IEEE IEMT2006 Best Paper Awards, Kiyokazu Yasuda, Katsumi Taniguchi, Tomoaki Goto, Michiya Matsushima, Kozo Fujimoto, IEEE(Institute of Electrical and Electronics Engineers),CPMT, 2006.11

  • Mate 2003 Excellent Paper Award, Kozo Fujimoto, Tosiyuki Hamano, Yositaka Ueki, Nakasuji, Japan Welding Society, 2003.02

  • MES2007 Best Paper Aword, Kousi Ohta, Masao Toya, Shinichi Motoshige, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto, Institute of Electronics Packaging, 2008.09

  • 2003 ICEP Outstanding Technical Paper Award, Kiyokazu YASUDA, Jong-Min KIM, Masahiro RITO, Kozo FUJIMOTO, Japan Institute of Electronics Packaging, 2004.04

 

Conference management 【 display / non-display

  • International Conference, International Conference on Electronics Packaging , 2017.04

  • National Conference, 24th Sympojium on "Microjoining and Assembly Technology in Electronics", 2017.01

  • International Conference, International Conference on Electronics Packaging , 2016.04

  • International Conference, International Conference on Electronics Packaging , 2015.04

  • International Conference, International Conference on Electronics Packaging , 2014.04

display all >>