School personnel information



Organization 【 display / non-display

  • 2000.04.01 - 2003.12.31, Cooperative Research Center for Advanced Science and Technology, Professor

  • 2004.01.01 - 2010.03.31, Joining and Welding Research Institute, Professor

  • 2010.04.01 - 2010.06.30, Center for Advanced Science and Innovation, Specially Appointed Professor

  • 2010.07.01 - 2013.06.30, Joining and Welding Research Institute, Specially Appointed Professor

  • 2013.09.01 - 2017.03.31, Office for University-Industry Collaboration, Specially Appointed Professor

  • 2017.04.01 - 2019.08.31, Office for Industry-University Co-Creation, Specially Appointed Professor

  • 2019.09.01 - , Co-Creation Bureau, Specially Appointed Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1969.03
Osaka University Graduate School, Division of Engineering  Completed 1971.03
Osaka University Graduate School, Division of Engineering  Completed 1975.06

Employment Record 【 display / non-display

Vice President, Collaborative Research Center for Advanced Science and Technology, Osaka University 2001.04 - 2003.03
Director of Smart Processing Research Center 2005.04 - 2007.03

Research topics 【 display / non-display

  • Smart Green Processing, Lead-free soldering, Low energy processing, Eco low environmentally impact separation, Eco joining, Aluminum brazing
    Material processing and microstructure control-related, Environmental materials and recycle technology-related, Metals production and resources production-related

Academic Society Membership 【 display / non-display

  • American Weld. Soc.

  • The Minerals, Metals & Materials Society

  • Copper and Copper Alloys Engineering Society


Academic Papers 【 display / non-display

  • Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste, YAMAKAWA Tomohiro, TAKEMOTO Tadashi, SHIMODA Masayoshi, NISHIKAWA Hiroshi, SHIOKAWA Kunio and TERADA Nobuto, Journal of Electronic Materials,42, 6 (2013) 1260-1267., 2013.06, Papers

  • Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder, SHIMODA Masayoshi, YAMAKAWA Tomohiro, SHIOKAWA Kunio, NISHIKAWA Hiroshi and TAKEMOTO Tadashi, Trans. JWRI,41, 2 (2012) , 2012.12, Research Organization Report

  • Dynamic Mechanical Behavior of Sn-Bi Lead-Free Solders by Tensile Test under High Strain Rate, Kiyokazu Yasuda, Yoshihiro Sakino, Ikuo Shohji, Tadashi Takemoto, Hiroshi Nishikawa, Proceedings of the International Symposium on Visualization in Joining & Welding Science Through Advanced Measurements and Simulation,2 7, 2012.11, International Conference(Proceedings)

  • Impact Strength of Sn-Ag-Cu Solder Joints in Electroless Ni-P/Au Plating in Laser Reflow Soldering, NISHIKAWA Hiroshi, IWATA Noriya and TAKEMOTO Tadashi, Trans. JWRI,41, 1 (2012) 33-36., 2012.06, Research Organization Report

  • Reliability of Electronics Assembled Joints, T. Takemoto, The Journal of Reliability Engineering Association of Japan,34, 4 (2012) 218-224., 2012.05, Review Papers(In Japanese)

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Books 【 display / non-display

  • Special, Rare Metal Handbook, T. Takemoto, Maruzen, ISBN, 978-4-621-08276-8, 2011.04

  • Special, Metal-biotechnology for Environmental Conservation and Resource Recycling -- The Key Technology for Safe and Sustainable Use of Metal Elements --, T.takemoto, et al., CMC Pub. Co., Ltd., ISBN, 978-4-7813-0117-4, 2009.03

  • Special, Microjoining and nanojoining, T. Takemoto, Woodhead Pub. Ltd, ISBN, 978-1-84569-179-0, 2008.04

Patents / Utility models / Designs 【 display / non-display

  • Japan, Alloy Sorting Method and Sorting System, T. Takemoto, H. Nishikawa and S. Katayama, 特願2003-003911(Registration), 2003.01

Awards 【 display / non-display

  • Best Poster Award, IWJC-Korea 2007, Feng Gao, Hiroshi Nishikawa and Tadashi Takemoto, Korean Welding and Joining Society, 2007.05

  • FELLOW OF JAPAN WELDING SOCIETY, Tadashi Takemoto, Japan Welding Society, 2006.04

  • Philips Best paper Award, Feng GAO and Tadashi TAKEMOTO, China Electronics Packaging Society, 2005.09

  • Highly Commended Award, Tadashi TAKEMOTO, 2005.06

  • IMS result prize, Tadashi Takemoto, Manufacture technology center IMS center, 2004.11

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