School personnel information



Mail Address

Mail Address


Organization 【 display / non-display

  • 2002.04.01 - 2004.12.31, Graduate School of Engineering, Research Assistant

  • 2005.01.01 - 2006.07.31, Joining and Welding Research Institute, Research Assistant

  • 2006.08.01 - 2007.03.31, Joining and Welding Research Institute, Associate Professor

  • 2007.04.01 - 2018.03.31, Joining and Welding Research Institute, Associate Professor

  • 2018.04.01 - , Joining and Welding Research Institute, Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1997.03
Osaka University Graduate School, Division of Engineering  Completed 1999.03
Osaka University Graduate School, Division of Engineering  Completed 2002.03

Research topics 【 display / non-display

  • Composite materials and interfaces-related, Material processing and microstructure control-related, Electron device and electronic equipment-related


Academic Papers 【 display / non-display

  • Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications, Shunichi Koga, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno, Journal of Electronic Materials,49, 3 (2020) 2151-2158., 2020.03, Papers

  • Wettability, interfacial reactions, and impact strength of Sn-3.0Ag-0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere, Siliang He, Runhua Gao, Yu-An Shen, Jiahui Li, Hiroshi Nishikawa, Journal of Materials Science,55, 7 (2020) 3107-3117., 2020.03, Papers

  • In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere, Siliang He, Runhua Gao, Jiahui Li, Yu-An Shen, Hiroshi Nishikawa, Materials Chemistry and Physics,239, (2020) 122309., 2020.01, Papers

  • Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate, Shiqi Zhou, Siliang He, Hiroshi Nishikawa, Journal of Nanoscience and Nanotechnology,20, 1 (2020) 106-112., 2020.01, Papers

  • Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology, Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa, Materials & Design,183, (2019) 108144., 2019.12, Papers

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Books 【 display / non-display

  • Special, Novel Structured Metallic and Inorganic Materials, Hiroshi Nishikawa, Springer, ISBN, 978-981-13-7610-8, 2019.07

  • Special, The Latest Technology of Epoxy Resin for Electronic Devices II, Hiroshi Nishikawa, CMC Pub. Co., Ltd., ISBN, 978-4781303147, 2011.01

Patents / Utility models / Designs 【 display / non-display

  • Japan, Alloy Sorting Method and Sorting System, T. Takemoto, H. Nishikawa and S. Katayama, 特願2003-003911(Registration), 2003.01

Awards 【 display / non-display

  • 67th ECTC Best Interactive Session Paper, Hiroshi Nishikawa, IEEE Electronics Packaging Society, 2018.05

  • Best Student Paper Award, 3rd Place, Shiqi Zhou, Xiangdong Liu, Omid Mokhtari and Hiroshi Nishikawa, Chinese Institute of Electronics, China, 2017.08

  • Osaka University Presidential Awards for Encouragement, Hiroshi Nishikawa, Osaka University, 2015.07

  • Outstanding Poster Paper Award, Li-Ngee Ho, Hiroshi Nishikawa, EMAP/ISMP 2013, 2013.10

  • IEC 1906 Award, Hiroshi Nishikawa, The International Electrotechnical Commission, 2013.06

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