School personnel information

写真b

NISHIKAWA Hiroshi


Mail Address

Mail Address

URL

http://www.jwri.osaka-u.ac.jp/~spc3/index.html

Organization 【 display / non-display

  • 2002.04.01 - 2004.12.31, Graduate School of Engineering, Research Assistant

  • 2005.01.01 - 2006.07.31, Joining and Welding Research Institute, Research Assistant

  • 2006.08.01 - 2007.03.31, Joining and Welding Research Institute, Associate Professor

  • 2007.04.01 - 2018.03.31, Joining and Welding Research Institute, Associate Professor

  • 2018.04.01 - , Joining and Welding Research Institute, Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 1997.03
Osaka University Graduate School, Division of Engineering  Completed 1999.03
Osaka University Graduate School, Division of Engineering  Completed 2002.03

Research topics 【 display / non-display

  • Composite materials and interfaces-related, Material processing and microstructure control-related, Electron device and electronic equipment-related

 

Academic Papers 【 display / non-display

  • Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology, Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa, Materials & Design,183, (2019) 108144., 2019.12, Papers

  • Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Zhi Jin, Yu-An Shen, Siliang He, Shiqi Zhou and Y. C. Chan and Hiroshi Nishikawa, Journal of Applied Physics,126, 18 (2019) 185109., 2019.11, Papers

  • Biosynthesis of bismuth selenide nanoparticles using chalcogen-metabolizing bacteria, Kuroda, M., Suda, S., Sato, M., Ayano, H., Ohishi, Y., Nishikawa, H., Soda, S., Ike, M., Applied Microbiology and Biotechnology,103:8853–8861, 2019.10, Papers

  • Effect of bonding temperature on shear strength of joints using micro-sized Ag particles for high temperature packaing technokigy, Hiroshi Nishikawa, Myong-Hooh Roh, Akira Fujita, Nobuo Kamada, Proc. of 22nd Microelectronics and Packaging Conference (EMPC),(2019) MT-12-1-MT-12-4., 2019.09, International Conference(Proceedings)

  • Tin Whisker Growth Mechanism on Tin Plating of MLCCs Mounted with Sn-3.5Ag-8In-0.5Bi Solder in 30deg C 60%RH, Akira Saito, Hiroshi Nishikawa, Proc. of 22nd Microelectronics and Packaging Conference (EMPC),(2019) R&Q-02-1-R&Q-02-4., 2019.09, International Conference(Proceedings)

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Books 【 display / non-display

  • Special, Novel Structured Metallic and Inorganic Materials, Hiroshi Nishikawa, Springer, ISBN, 978-981-13-7610-8, 2019.07

  • Special, The Latest Technology of Epoxy Resin for Electronic Devices II, Hiroshi Nishikawa, CMC Pub. Co., Ltd., ISBN, 978-4781303147, 2011.01

Patents / Utility models / Designs 【 display / non-display

  • Japan, Alloy Sorting Method and Sorting System, T. Takemoto, H. Nishikawa and S. Katayama, 特願2003-003911(Registration), 2003.01

Awards 【 display / non-display

  • 67th ECTC Best Interactive Session Paper, Hiroshi Nishikawa, IEEE Electronics Packaging Society, 2018.05

  • Best Student Paper Award, 3rd Place, Shiqi Zhou, Xiangdong Liu, Omid Mokhtari and Hiroshi Nishikawa, Chinese Institute of Electronics, China, 2017.08

  • Osaka University Presidential Awards for Encouragement, Hiroshi Nishikawa, Osaka University, 2015.07

  • Outstanding Poster Paper Award, Li-Ngee Ho, Hiroshi Nishikawa, EMAP/ISMP 2013, 2013.10

  • IEC 1906 Award, Hiroshi Nishikawa, The International Electrotechnical Commission, 2013.06

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