Academic Papers

Division display >> ／  All the affair displays  1 - 351 of about 351

  1. Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating, Yukiko Mizuguchi, Yosuke Murakami, Shigetaka Tomiya, Tadashi Asai, Tomoya Kiga and Katsuaki Suganuma, Journal of Electronic Materials, 2012.09, Papers

  2. Inkjet-printed lines with well-defined morphologies and low electrical resistance on repellent pore-structured polyimide films, Changjae Kim, Masaya Nogi, Katsuaki Suganuma, Yo Yamato, ACS Applied Materials & Interfaces, 2012.03, Papers

  3. Printed Silver Nanowire Antennas with Low Signal Loss at High-Frequency Radio, Natsuki Komoda, Masaya Nogi, Katsuaki Suganuma, Kazuo Kohno, Yutaka Akiyama, Kanji Otsuka, Nanoscale, 2012.03, Papers

  4. Effect of Crystal Orientation on Mechanically Induced Sn Whiskers of Sn-Cu Platings, Y. Mizuguchi, Y. Murakami, S. Tomiya, T. Asai, T. Kiga, K. Suganuma, 2012.03, International Conference(Non Proceeding)

  5. Heat-resistant die-attach technology for SiC, K. Suganuma, 2012.03, International Conference(Non Proceeding)

  6. Electrical conductivity enhancement in inkjet-printed narrow lines through gradual heating, Changjae Kim, Masaya Nogi and Katsuaki Suganuma, Journal of Micromechanics and Microengineering, 22 035016 , 2012.02, Papers

  7. Silver nanowire printed line; Relationship of Heating temperature and its conductivity, N. Komoda, M. Nogi, K. Suganuma, 2012.01, International Conference(Proceedings)

  8. Transparent electrodes with network structures of silver nanowires, T. Tokuno, M. Nogi, J. Jiu, K. Suganuma, 2012.01, International Conference(Proceedings)

  9. Inkjet printing of well-defined and narrow conductive lines on polymeric substrates with chemical treated coating layers, C. Kim, M. Nogi, K. Suganuma, 2012.01, International Conference(Proceedings)

  10. Silver nanowire flexible antenna for printed electronics, N. Komoda, M. Nogi, K. Kohno, K. Otsuka, K. Suganuma, 2011.11, International Conference(Proceedings)

  11. Electrical conductivity enhancement of silver nanowire transparent electrodes at low temperature, T. Tokuno, M. Nogi, J. Jiu, K. Suganuma, 2011.11, International Conference(Proceedings)

  12. Inkjet Printing of Conductive Lines : Improvement of Line Morphology and Electrical Conductivity, C. J. Kim, M. Nogi, K. Suganuma, 2011.11, International Conference(Proceedings)

  13. Stretchable and conductive wirings having various electrical properties to different volume fraction of silver flakes, T. Araki, M. Nogi, K. Suganuma, K. Kihara, O. Kirihara, 2011.11, International Conference(Proceedings)

  14. Characteristics of die attach joints with Zn high temperature lead-free solders, S.W. Park, K. Suganuma, 2011.11, International Conference(Proceedings)

  15. Behaviors of Sn surface with whisker generation after thermal cycle, J.-L. Jo, K. Lee, K. Suganuma, 2011.11, International Conference(Proceedings)

  16. Fabrication of Silver Nanowire Transparent Electrodes at Room Temperature, T. Tokuno, M. Nogi, M. Karakawa, J. Jiu, T. T. Nge, Y. Aso, K. Suganuma, Nano Research, 4 1215-1222 , 2011.10, Papers

  17. Preparation of Ag Nanowires and Application in Optoelectronic Devices, Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.10, International Conference(Proceedings)

  18. Preparation of Ag Nanowires and Application in Optoelectronic Devices, Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.10, International Conference(Proceedings)

  19. Advanced in wiring ink technology for printed electronics, K.Suganuma, 2011.10, International Conference(Non Proceeding)

  20. Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling, J.-L. Jo, K.-S. Kim, K. Suganuma, 2011.10, International Conference(Proceedings)

  21. Low-temperature Low-pressure Die Attach with Hybrid Silver Particle Paste, K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. -S. Kim, M. Nogi, Microelectron. Reliab, 52 375?380 , 2011.09, Papers

  22. Room temperature fabrication of silver nanowire transparent electrodes, T. Tokuno, M. Nogi, M. Karakawa, J. Jiu, Y. Aso, K. Suganuma, 2011.09, International Conference(Proceedings)

  23. Printable and Stretchable Conductive Wirings Comprising Silver Flakes and Elastomer, M. Nogi, K. Suganuma, M. Kogure, O. Kirihara, IEEE Electron Device Lett., 32 1424 - 1426 , 2011.08, Papers

  24. Preparation of rod-shaped and spherical Silvernanoparticles and application for Packaging materials, Jinting Jiu, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

  25. Return Loss of Printed Silver Paste Lines with Different Filler Sizes and Their Surface Roughness, Natsuki Komoda, Katsuaki Suganuma, Masaya Nogi, 2011.08, International Conference(Proceedings)

  26. Effect of Ink Viscosity on Electrical Resistivity of Narrow Printed Silver Lines, ChangJae Kim, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

  27. Properties of Silver Nanowire Transparent Electrodes Fabricated by a Coating Method, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

  28. Preparation and characterization of bacterial cellulose/chitosan porous scaffolds, Thi Thi Nge, Masaya Nogi, Hiroyuki Yano, Junji Sugiyama, 2011.08, International Conference(Proceedings)

  29. Preparation of rod-shaped and spherical Silvernanoparticles and application for Packaging materials, Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

  30. Return Loss of Printed Silver Paste Lines with Different Filler Sizes and Their Surface Roughness, K. Natsuki, K. Suganuma, M. Nogi, 2011.08, International Conference(Proceedings)

  31. Effect of Ink Viscosity on Electrical Resistivity of Narrow Printed Silver Lines, C. Kim, M. Nogi, K.Suganuma, 2011.08, International Conference(Proceedings)

  32. Properties of Silver Nanowire Transparent Electrodes Fabricated by a Coating Method, T. Takehiro, M. Nogi. , K. Suganuma, 2011.08, International Conference(Proceedings)

  33. Low temperature die-attaching with silver particle pastes, K. Suganuma, S. Sakamoto, N. Kagami and M. Nogi, 2011.07, International Conference(Non Proceeding)

  34. Low temperature wirings and conductive films with Ag nano inks, M. Nogi, K. Suganuma, 2011.06, International Conference(Non Proceeding)

  35. Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint, Kiju Lee*,Keun-Soo,Kim,Yutaka Tsukada,Katsuaki Suganuma,Kimihiro Yamanaka, Soichi Kuritani,Minoru Ueshima, Microelectron. Reliab, 51[12] 2290-2297 , 2011.05, Papers

  36. Size Effect on Resistivity of Narrow Printed Tracks, ChangJae Kim, Masaya Nogi, Katsuaki Suganuma, 2011.04, International Conference(Proceedings)

  37. Effects of Cu-bearing Flux on Sn-3.5Ag Soldering with Electroless Ni-P/Au Surface Finish: Microstructure and Joint Reliability, H. Sakurai, K-S. Kim, Y. Kukimoto, K. Suganuma, 2011.02, International Conference(Non Proceeding)

  38. Electromigration Behavior of Sn-In Lead-Free Solder Alloy Under High Current Stress, K. Lee, K-S. Kim, K. Suganuma, 2011.02, International Conference(Non Proceeding)

  39. Whisker Growth Behavior in a High Vacuum with Thermal Cycling, K-S. Kim, J. Jo, K. Lee, A. Baated, K. Suganuma, N. Nemoto, T. Nakagawa, T. Yamada, 2011.02, International Conference(Non Proceeding)

  40. Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating,, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2011.01, International Conference(Proceedings)

  41. Super Stretchable and Flexible Conductive Elastomer, T. Araki, N. Nogi, K. Suganuma, 2011.01, International Conference(Proceedings)

  42. Low Temperature Wiring Technology for Printed Electronics, K. Suganuma, M. Nogi, M. Hatamura, T. Araki, J. Jiu, 2010.12, International Conference(Non Proceeding)

  43. Effects of crystallographic orientation of Sn on electromigration behavior, K. Lee, K.S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma, 2010.11, International Conference(Proceedings)

  44. Low temperature wiring with silver nano-inks, K.Suganuma, 2010.10, International Conference(Non Proceeding)

  45. High temperature lead-free solders(Plenary), K. Suganuma, 2010.09, International Conference(Non Proceeding)

  46. The effect of microvia-in-pads design on SMT defects in ultra-small component assembly, Y.W. Lee, K.S. Kim, K. Suganuma, 2010.08, International Conference(Proceedings)

  47. Effects of the crystallographic orientation of Sn grain during electromigration test, K. Lee, K. S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma, 2010.08, International Conference(Proceedings)

  48. Optically transparent substrates from plants nanofibers for printed electronics, M. Nogi, K.Suganuma, and H. Yano, 2010.06, International Conference(Proceedings)

  49. Tin Whisker Evaluation Status for Space Application, N. Nemoto, T. Nakagawa, T. Yamada, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  50. Evaluation of Conformal Coating for Mitigation of Tin Whisker Growth (Part II), T. Nakagawa, T. Yamada, N. Nemoto, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  51. Tin Whisker Mitigation Project of JEITA, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  52. Low Temperature Nano-Ag Wiring on Textiles by Ink-jet print, J. Jiu, K. Suganuma, C. Kim, D. Wakuda, M. Nogi, Y. Linm P. Chen, 2010.06, International Conference(Proceedings)

  53. Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating,, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2010.06, International Conference(Proceedings)

  54. Formation mechanism of nanostructured Ag films from Ag2O particles using a sonoprocess, M. Inoue, Y. Hayashi, H. Takizawa, K. Suganuma, Colloid and Polymer Science, 288 1061-1069, 2010.05, Papers

  55. Prevention technologies of whisker growth for reliable electronic, K.Suganuma, 2010.05, International Conference(Non Proceeding)

  56. Intermetallic growth rate effects on spontaneous whisker growth from Tin coating on copper, A. Baated, K.S. Kim, K. Suganuma, 2010.05, International Conference(Proceedings)

  57. Intermetallic Growth Rate Effects on Spontaneous Whisker Growth from Tin Coating on Copper, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2010.05, International Conference(Proceedings)

  58. Effects of Zn-containing Flux on the Joint Strength and Microstructure of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish, H. Sakurai, A. Baated, K. Lee, S. Kim, K.S. Kim, K. Suganuma, 2010.02, International Conference(Non Proceeding)

  59. Effect of Zn-Containing Flux on the Joint Strength and Microstructure? of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish, H. Sakurai, Y. Kukimoto, K. Suganuma, 2010.02, International Conference(Proceedings)

  60. Influential factors in determining the adhesive strength of ACF joints, M. Inoue, K. Suganuma, J. Mater. Sci.: Materials in Electronics, 20 1247-1254, 2009.10, Papers

  61. Variations in polymeric structures of ferroelectric poly(vinylidene fluoride) films during annealing at various temperatures, M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro, J. Appl. Polymer Sci., 111 2837-2847, 2009.09, Papers

  62. Electrical properties of isotropic conductive adhesives composed of silicone-based elastomer binders containing Ag particles, M. Inoue, H. Muta, S. Yamanaka, K. Suganuma, J. Electron. Mater., 38 2013-2022, 2009.09, Papers

  63. Room-Temperature Sintering Process of Ag Nanoparticle Paste, D. Wakuda, K. S. Kim, K. Suganuma, IEEE T. Compon. Pack. T., 32 3 627-632, 2009.09, Papers

  64. Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding, D. Wakuda, K. S. Kim, K. Suganuma, 2009.07, International Conference(Proceedings)

  65. Low temperature wiring with Ag inks-New beta-ketocarboxylate Ag inks for 100 ?C curing, M. Kawazome, K. S. Kim, K. Suganuma, 2009.07, International Conference(Proceedings)

  66. Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity environment, S. S. Kim, K. S. Kim, S. Kim, K. Suganuma, J. Electron. Mater., 38 6 896-901, 2009.06, Papers

  67. Eco-fabrication of metal nanoparticle related materials by home electric appliances, Y. Hayashi, M. Inoue, I. Narita, K. Suganuma, H. Takizawa, Mater. Sci. Forum, 620-622 185-188, 2009.06, Papers

  68. Stretchable human interface using conductive silicone elastomer containing silver fillers, Masahiro Inoue, Katsuaki Suganuma, Hiroshi Ishiguro, Proceedings of the 13th IEEE International Symposium on Consumer Electronics, pp.714-717, 2009.05, International Conference(Proceedings)

  69. Stretchable human Interface using conductive silicone elastomer containing silver fillers, *M. Inoue, K. Suganuma, H. Ishiguro, 2009.05, International Conference(Proceedings)

  70. Properties of Ag Nanoparticle Paste for Room Temperature Bonding, D. Wakuda, K. S. Kim, K. Suganuma, 2009.05, International Conference(Proceedings)

  71. Ink-jet Printing of Ag Nanoparticle and Ag carboxylate Inks on Papers, M. Kawazome, K. S. Kim, K. Suganuma, 2009.05, International Conference(Proceedings)

  72. Eco-fabrication of noble metal nanoparticles by metal oxide and home electronics appliances, Y. Hayashi, *M. Inoue, I. Narita, K. Toisawa, T. Yamada, Y. Sekiguchi, H. Takizawa, K. Suganuma, 2009.04, International Conference(Proceedings)

  73. Room Temperature Sintering and Bonding with Ag Nanoparticle Paste, D. Wakuda, K. S. Kim, K. Suganuma, 2009.04, International Conference(Proceedings)

  74. Preparation of Ag nanorods with high yield by polyol process, J. Jiu, K. Murai, D.S. Kim, K.S. Kim, K. Suganuma, Materials Chemistry and Physics, 114 333-338, 2009.03, Papers

  75. Physical Factors Determining Thermal Conductivities of Isotropic Conductive Adhesives, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma, J. Electron. Mater., 38 430-437, 2009.03, Papers

  76. Whisker Growth on Sn Plating with or without Surface Treatment during Heat and Humid Environments, *K.S. Kim, S.S. Kim, A. Baated, K. Hamasaki, K. Suganuma, M.Tsujimoto, I.Yanada, 2009.02, International Conference(Non Proceeding)

  77. Whisker Growth Behavior of Tin and Tin Alloy Lead-Free Finishes, *K. Suganuma, K.S. Kim, S.S. Kim, A. Baated, K. Hamasaki, 2009.02, International Conference(Non Proceeding)

  78. Interfacial Reaction and Thermal Cycling Reliability of Zn-Sn High Temperature Lead-Free Solders, *S.J. Kim, K.S. Kim, G. Izuta, K. Suganuma, 2009.02, International Conference(Non Proceeding)

  79. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders, S.J. Kim, K.S. Kim, S.S. Kim, K. Suganuma, J. Electron. Mater., 38 266-272, 2009.02, Papers

  80. High-temperature lead-free solders: properties and possibilities, K. Suganuma, S.J. Kim, K.S. Kim, JOM, 61 64-71, 2009.01, Papers

  81. Degradation Mechanism of Conductive Adhesive/Sn Interface under High Humidity, *S.S. Kim, K.S. Kim, S.J. Kim, K. Suganuma, 2008.11, International Conference(Proceedings)

  82. Synthesis and nanostructure of boron nitride nanotubes grown from iron-evaporated boron, T.Oku, N. Koi, K. Suganuma, Diamond and Related Materials, 17 1805-1807, 2008.10, Papers

  83. Synthesis of Ag nanorods and application to soft die attaching, *J. Jiu, K. Murai, K.S. Kim and K. Suganuma, 2008.09, International Conference(Proceedings)

  84. Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent, *D. Wakuda, K.S. Kim, K. Suganuma, 2008.09, International Conference(Proceedings)

  85. Room Temperature Sintering Mechanism of Ag Nanoparticle Paste, *D. Wakuda, C.J. Kim, K.S. Kim, K. Suganuma, 2008.09, International Conference(Proceedings)

  86. Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure, *S.S. Kim, K.S. Kim, K. Suganuma, H. Tanaka, 2008.09, International Conference(Proceedings)

  87. Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders, *S.J. Kim, K.S. Kim, G. Izuta, K. Suganuma, 2008.09, International Conference(Proceedings)

  88. Room temperature sintering of Ag nanoparticles by drying solvent, D. Wakuda, K.S. Kim, K. Suganuma, Scripta Materialia, 59 649-652, 2008.09, Papers

  89. Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions, J. Jiang, J.E. Lee, K.S. Kim, K. Suganuma, J. Alloys and Compounds, 462 244-251, 2008.08, Papers

  90. Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles, N. Koi, T. Oku, M. Inoue, K. Suganuma, J. Materials Science, 43 2955-2961, 2008.08, Papers

  91. Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu, *A. Baated, K.S. Kim, K. Suganuma, S. Huang, M. Ueshima, B. Jurcik, S. Nozawa, 2008.07, International Conference(Non Proceeding)

  92. Large-scale synthesis of micrometer-scale single-crystal gold nanosheets by polyol process, *J. Jiu, K. Suganuma, K.S. Kim, T. Nemoto, T. Ogawa, S. Isoda, 2008.07, International Conference(Non Proceeding)

  93. Developing the Stencil Printing Process for 01005 Lead-Free Assemblies, *Y.W. Lee, K.S. Kim, K. Suganuma, J.H. Kim, 2008.07, International Conference(Proceedings)

  94. Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application, S.J. Kim, K.S. Kim, S.S. Kim, C.Y. Kang, K. Suganumai, Materials Transactions, 49 1531-1536, 2008.07, Papers

  95. The root causes of the "black pad" phenomenon and avoidance tactics, K. Suganuma, K.S. Kim, JOM, 60 61-65, 2008.06, Papers

  96. Electronic and optical properties of boron nitride nanotubes, T. Oku, N. Koi, K. Suganumai, J. Physics and Chemistry of Solids, 69 1228-1231, 2008.06, Papers

  97. Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound, S. Kumamoto, H. Sakurai, Y. Kukimoto, K. Suganumai, J. Electron. Mater., 37 806-814, 2008.06, Papers

  98. Variations in polymeric structure of ferroelectric poly(vinylidene fluoride) films during annealing at various temperatures, M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro, J. Applied Polymer Science, 111 2837-2843, 2008.06, Papers

  99. Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy, J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, K. Suganuma, J. Alloys and Compounds, 454 310-320, 2008.04, Papers

  100. Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma, J. Electron. Mater., 37 462-468, 2008.04, Papers

  101. Prevention of Sn Whisker Formation by Surface Treatment of Sn Plating Part 2, *K.S. Kim, S.S. Kim, S.K. Kim, K. Suganuma, M. Tsujimoto, I. Yanadaa, 2008.03, International Conference(Non Proceeding)

  102. Degradation of Ag-Epoxy Conductive Adhesive/Sn Interface in Humid Atmosphere, S.S. Kim, K.S. Kim and K. Suganuma, 2008.03, International Conference(Proceedings)

  103. Interfacial Reactions of Die Attached AlN-DBC Module Using Zn-Sn High Temperature Solders, S.J. Kim, K.S. Kim, D.S. Kim and K. Suganuma, 2008.03, International Conference(Proceedings)

  104. Novel method for room temperature sintering of Ag nanoparticle paste in air, D. Wakuda, M. Hatamura, K. Suganuma, Chemical Physics Letters, 441 4-6 305-308, 2008.01, Papers

  105. The dependence on thermal history of the electrical properties of an epoxy-based isotropic conductive adhesive, M. Inoue, K. Suganuma, J. Electronic Materials, 36 6 669-675, 2008.01, Papers

  106. A study on solder electromigration in Cu/In/Cu flip-chip joint system, K. Yamanaka, Y. Tsukada, K. Suganuma, エレクトロニクス実装学会誌, 11 1 60-65, 2008.01, Papers

  107. Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy, J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, K. Suganuma, J. Alloys and Compounds, 454 1-2 310-320, 2008.01, Papers

  108. Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles, N. Koi, T. Oku, M. Inoue, K. Suganuma, J. Materials Science, 43 8 2955-2961, 2008.01, Papers

  109. A super-flexible sensor system for humanoid robots and related applications, M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, H. Ishiguro, エレクトロニクス実装学会誌, 11 2 136-140, 2008.01, Papers

  110. Microstructure development of mechanical-deformation-induced Sn whiskers, *S. K. Lin, Y. Yorikado, J. Jiang, K.S. Kim, K. Suganuma, S.W. Chen, M. Tsujimoto, I. Yanada, J. Electronic Mater., 36 12 1732-1734, 2007.12, Papers

  111. Design and synthesis of mesoporous nano-silver-based die attach material for high power electronics, K. Suganuma, J. Jiu, D.S. Kim, K.S. Kim, 2007.11, International Conference(Proceedings)

  112. Impact property evaluation of Ag-epoxy conductive adhesive joint, D.S. Kim, M. Kang, K.S. Kim, S.S. Kim, S.J. Kim, K. Suganuma, 2007.11, International Conference(Proceedings)

  113. Zn-Sn and Zn-In high temperature lead-free solders, K. Suganuma, S.J. Kim, J.E. Lee, K.S. Kim,, 2007.11, International Conference(Proceedings)

  114. Room Temperature Sintering of Ag Nanoparticle Paste and its Mechanism, D. Wakuda, M. Hatamura and K. Suganuma, 2007.11, International Conference(Proceedings)

  115. A Flexible and Stretchable Tactile Sensor Utilizing Static Electricity, Y. Tada, M. Inoue, T. Kawasaki, Y. Kawahito, H. Ishiguro, K. Suganuma, 2007.10, International Conference(Proceedings)

  116. Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system, *K. Yamanaka, Y. Tsukada, K. Suganuma, Microelectronics Reliability, 47 8 1280-1287, 2007.08, Papers

  117. Thermal stability of poly (vinylidene fluoride) films pre-annealed at various temperatures, Masahiro Inoue, Yasunori Tada, Katsuaki Suganuma and Hiroshi Ishiguro, Polymer Dgradation and Stability, Vol. 92, No. 10, pp. 1833-1840, 2007.07, Papers

  118. Properties of low temperature Sn-Ag-Bi-In solder systems, *K.S. Kim, T. Imanishi, K. Suganuma, M. Ueshima, R. Kato, Microelectronics Reliability, 47 7 1113-1119, 2007.07, Papers

  119. Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging, *S.K. Lin, Y. Yorikado, J. Jiang, K.S. Kim, K. Suganuma, S.W. Chen, M. Tsujimoto, I. Yanada, J. Materials Research, 22 7 1975-1986, 2007.07, Papers

  120. Sn-Ag-Cu soldering reliability influenced by process atmosphere, *A. Baated, J. Jiang, K.S. Kim, K. Suganuma, S. Huang, B. Jurcik, S. Nozawa, M. Ueshima, 2007.06, International Conference(Proceedings)

  121. Temperature dependence of electrical resistivity of isotropic conductive adhesive composed of an epoxy-based binder, M. Inoue, H. Muta, S. Yamanaka, K. Suganuma, 2007.06, International Conference(Proceedings)

  122. Ink-jet printing of Nano Materials and Process for Electronics Applications, K. Suganuma, D. Wakuda, M. Hatamura, K.S. Kim,, 2007.06, International Conference(Proceedings)

  123. A super-flexible sensor system for humanoid robots and related applications, M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, H. Ishiguro,, 2007.04, International Conference(Proceedings)

  124. Sn-Zn low temperature solder, *K. Suganuma, K.S. Kim, J. Materials Science: Materials in Electronics, 18 1-3. 121-127, 2007.03, Papers

  125. Solder electromigration in Cu/In/Cu flip chip joint system, *K. Yamanaka, Y. Tsukada, K. Suganuma, J. Alloys and Compounds, 437 1-2. 186-190, 2007.02, Papers

  126. Dissolution of copper on Sn-Ag-Cu system lead free solder, *G. Izuta, T. Tanabe, K. Suganuma, Soldering & Surface Mount Technology, 19 2 4-11., 2007.02, Papers

  127. Process development and application of noble metal nanoparticle related materials by total eco-design, Y. Hayashi, D. Ishikawa, H. Takizawa, M. Inoue, K. Suganuma, K. Niihara, 粉体および粉末冶金, 54 3 186-193, 2007.01, Papers

  128. Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder, J.E. Lee, K.S. Kim, K. Suganuma, M. Inoue, G. Izuta, Materials Transactions, 48 3 584-593, 2007.01, Papers

  129. Formation and atomic structures of boron nitride nanotubes with cup-stacked and Fe nanowire encapsulated structures, T. Oku, N. Koi, I. Narita, K. Suganuma, Materials Transactions, 48 4 722-729, 2007.01, Papers

  130. Formation and atomic structure of boron nitride nanotubes with a cup-stacked structure, T. Oku, N. Koi, K. Suganuma, R.V. Belosludov, Y. Kawazoe, Solid State Communications, 143 6-7 331-336, 2007.01, Papers

  131. Thermal stability of poly(vinylidene fluoride) films pre-annealed at various temperatures, M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro, Polymer Degradation and Stability, 92 10 1833-1840, 2007.01, Papers

  132. Influential factor in determining the thermal conductivity of isotropic conductive adhesives, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka and K. Suganuma, Proc. EcoDesign 2006 Asia-Pacific Conference, 2006.12, Conference Report / Oral Presentation

  133. Development of super flexible touch sensors, M. Inoue, K. Suganuma, T. Miyashita, H. Ishiguro, 11, [10], pp. 44-48, 2006.10, Review Papers(In Japanese)

  134. Development of an electrophoretic sol-gel coating process for porous metals, M. Inoue, S.-K. Hyun, K. Suganuma, H. Nakajima, Materials Transactions, 47 [9], 2161-2166, 2006.09, Papers

  135. Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka and K. Suganuma, Proceedings of HDP’06, pp.63-68, 2006.06, Conference Report / Oral Presentation

  136. Development of skin sensors for humanoid robots using wiring technology with conductive adhesives, M.Inoue, H.Sasaki, K.Suganuma, T.Kawasaki, T.Rokuhara, T.Miyashita, H.Ishiguro, pp.247-248, 2006.03, Conference Report / Oral Presentation (In Japanese)

  137. Formation of ceramic coatings on porous metals by electrophoretic sol-gel deposition, M. Inoue, S.-K. Hyun, K. Suganuma, H. Nakajima, Porous Metals and Metal Foaming Technology (Proc. of MetFoam 2005, Japan Inst. Metals), pp.655-658, 2006.02, International Conference(Proceedings)

  138. Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue and K. Suganuma, Soldering and Surface Mount Technology, vol.18, No.2, pp.40-46, 2006.02, Papers

  139. Analytical equations for predicting thermal properties of isotropic conductive adhesives, M. Inoue, T. Sugimura, M. Yamashita, S. Yamaguchi and K. Suganuma, Journal of Electronic Materials, vol. 34, No.12, pp.1586-1590, 2005.12, Papers

  140. Analytical Equations for Predicting The Thermal Properties of Isotropic Conductive Adhesives, M. Inoue, T. Sugimura, M. Yamashita, S. Yamaguchi and K. Suganuma, Journal of Electronic Materials, 34 , 1586-1590, 2005.12, Papers

  141. Interfacial Properties of Zn-Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate, L. E. Lee，K.-S. Kim and K. Suganuma, J. Takenaka, K. Hagio, Materials Transactions, 46, 2413-2418, 2005.11, Papers

  142. Joints Soldered on Electroless Ni-Au Surfaces using Cu-containing Flux: StrengthMicrostructure and mechanism of improvement, S. Kumamoto, H. Sakurai, K. Ikeda and K. Suganuma, Materials Transactions, 46 , 2380-2385., 2005.11, Papers

  143. Development of super-flexible wires using conductive adhesives for artificial skin applications in robots and related equipments, M. Inoue, Y. Yamasaki, K. Suganuma, T. Kawasaki, T. Rokuhara, T. Miyashita, H. Ishiguro, Proceedings of Polytronic 2005, pp.90-95, 2005.10, Conference Report / Oral Presentation

  144. Eco-designs and applications for noble metal nano-particles by ultrasound process, Y. Hayashi, H. Takizawa, M. Inoue, K. Niihara and K. Suganuma, IEEE Trans. Electronics Packaging Manufacturing, vol.28, No.4, pp.338-343, 2005.09, Papers

  145. Test speed dependency of peel strength of ACF joints, M. Inoue and K. Suganuma, Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), pp.145-148, 2005.06, Conference Report / Oral Presentation

  146. Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue and K. Suganuma, Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), pp.128-133, 2005.06, Conference Report / Oral Presentation

  147. Test speed dependency of peel strength of ACF joints, M. Inoue and K. Suganuma, Proceedings of HDP’05, pp.145-148, 2005.06, Conference Report / Oral Presentation

  148. Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue and K. Suganuma, Proceedings of HDP’05, pp.128-133, 2005.06, Conference Report / Oral Presentation

  149. Ecodesigns and Applications for Noble Metal Nanoparticles by Ultrasound Process, Y.Hayashi, H. Takizawa, M. Inoue, K. Niihara and K. Suganuma, IEEE Transactions on Electronics Packaging Manufacturing, 28 , 338-343., 2005.04, Papers

  150. Alumina/Aluminum Composite fabricated by Freeze and Dry Process with Water-Soluble Polymer Slurry, M. Nakata and K. Suganuma, Materials Science Forum, 486-487,329-332, 2005.03, Papers

  151. Effects of Bi and Pb on Oxidation in Humidity of Low Temperature Lead-Free Solder Systems, K.-S. Kim and K. Suganuma, 2005.02, Conference Report / Oral Presentation

  152. Sn-Zn based low temperature lead-free solder and current status of lead-free in Japan, K. Suganuma, 2005.02, Conference Report / Oral Presentation

  153. Effect of Internal Structure on Thermal Properties of Alumina/Aluminum Composites Fabricated by Gelate-Freezing and Partial-Sintering Process, Respectively, M. Nakata and K. Suganuma, Materials Transactions, 46, 130-135, 2005.01, Papers

  154. Synthesis of Huge Boron Nitride Cages, N. Koi, T. Oku, I. Narita and K. Suganuma, Diamond Relat. Mater, 14 , 1190-1192, 2005.01, Papers

  155. Effects of Endohedral Element in B24N24 Clusters on Hydrogenation Studied by Molecular Orbital Calculations, N. Koi, T. Oku, and K. Suganuma, Physica, E,29,541 -545, 2005.01, Papers

  156. Various Applications of Silver Nano-Particles by Ultrasonic Eco-Fabrication, Y.Hayashi, H, Tanizawa, Y. Saijo, T. Sekino, K. Suganuma and K. Niihara, Materials Science Forum, 486-487, 530-533, 2005.01, Papers

  157. Fabrication of Porous Alumina Sintered Bodies by A Gelate-Freezing Method, M.Nakata, K. Tanihata, S. Yamaguchi, and K. Suganuma, Journal of The Ceramic Society of Japan, 113 , 712-715, 2005.01, Papers

  158. Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints, K. S. Kim, K. Suganuma, T. Shimozaki, and C. G. Lee, Materials Science Forum, 439,7-11, 2005.01, Papers

  159. Development of Pb free solders and their industrial applications, K. Suganuma, 2004.12, Conference Report / Oral Presentation

  160. Properties of Zn-Sn Alloys and Intermetallic Compound Formation at Zn-Sn/Cu Joint Interface, J. –E. Lee, *K. -S. Kim and K. Suganuma, 2004.12, Conference Report / Oral Presentation

  161. Lead-free interconnects engineering in electronics packaging, K. Suganuma, K. S. Kim, and C. H. Hwang, 2004.11, Conference Report / Oral Presentation

  162. Lead-free soldering statues and projects of Japan, 菅沼克昭, 2004.11, Conference Report / Oral Presentation

  163. Lead-free soldering status and projects of Japan, K. Suganuma, 2004.11, Conference Report / Oral Presentation

  164. Synthesis and characterization of calcium phosphate-AMP composite material, M. Kaneno, K. Sakamoto, H. Nakayama, S. Yamaguchi and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  165. Friction-activated capillary soldering for hermetic seal of vacuum glazing; joining of a pair of glass sheets with lead-free solder, K. Sakaguchi, S. Domi, and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  166. Formation of hydroxyapatite from mechanochemically treated β-tricalcium bis (orthophosphate), M. Kaneno, K. Sakamoto, S. Yamaguchi, and K.Suganuma, 2004.11, Conference Report / Oral Presentation

  167. Fabrication and applications of nano-metal particle composites by ultrasonic eco-process, Y. Hayashi, Y. Saijo, T. Sekino, K. Suganuma, K. Niihara, 2004.11, Conference Report / Oral Presentation

  168. Effect of alumna structure on thermal properties of alumina/aluminum composite formed by freeze and dry process and partial sintering process, M. Nakata and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  169. Effects of composition on microstructure and on thermal stability of Sn-Ag-In lead-free soldered joints, K. S. Kim, T. Imanishi, K. Suganuma, S. Kumamoto, and M. Aihara, Trans. MRS-J, 29-5, 2005-2008, 2004.10, Papers

  170. Influence of Cu Addition to Interface Microstructure between Sn-Ag Solder and Au/Ni-6P Plating, C.-W. Hwang, K. Suganuma M. Kiso and S. Hashimoto, J. Electron.Mater., 33 [10] (2004) 1200-1209, 2004.10, Papers

  171. Thermal and humid stability of Sn-Ag-In lead-free soldered joints, T. Imanishi, K. S. Kim, K. Suganuma, Proceedings of MES2004, The 14th Micro Electronics Symposium, 229-232, 2004.10, Conference Report / Oral Presentation (In Japanese)

  172. Fracture pattern of solder joints with Sn-Zn lead-free solders after thermal exposure (in Japanese), Y. S. Kim, K. S. Kim, K. Suganuma, Proceedings of MES2004, The 14th Micro Electronics Symposium, 213-216, 2004.10, Conference Report / Oral Presentation (In Japanese)

  173. Interconnect Reliability of Anisotropic Conductive Adhesives for Advanced Electronics Packaging Technologies, M. Inoue and K. Suganuma, 2004.10, Conference Report / Oral Presentation

  174. Effects of composition on microstrcuture and on thermal stability of Sn-Ag-In lead-free soldered joints, K.S. Kim, T. Imanishi, K.Suganuma, S.Kumamoto and M.Aihara, Trans.Mater.Res.Soc.Jpn, 2004.09, Papers

  175. Next generation of lead-free solders: Low temperature solders, K. Suganuma, K.-S. Kim, K. Toyofuku, K. Hagio, 2004.09, Conference Report / Oral Presentation

  176. Eco-fabrications and applications of noble metal nano-particles by ultrasound, Y. Hayashi, M. Inoue, K. Niihara, K. Suganuma, Proc. Polytronic 2004, 2004.09, Conference Report / Oral Presentation

  177. Analysis of influential factors in determining adhesive strength of ACF joints, M. Inoue, T. Miyamoto, K. Suganuma, Proc. Polytronic 2004, 2004.09, Conference Report / Oral Presentation

  178. Formation mechanisms of various solidification defects in lead-free soldering and their prevention, K. Suganuma and K. -S. Kim, 2004.09, Conference Report / Oral Presentation

  179. Nano paste and new interconnection technology, K. Suganuma, M. Hayashi, K. -S. Kim, S. Yamaguchi and M. Hatamura, 2004.09, Conference Report / Oral Presentation

  180. Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films, M. Inoue, T. Miyamoto, K. Suganuma, Proc. The sixth IEEE CPMT Conferemce on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04),248-253, 248-253, 2004.06, International Conference(Non Proceeding)

  181. The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging, K. S. Kim, K. Suganuma, J. M. Kim, and C. W. Hwang, JOM, 56-6, 2004.06, Papers

  182. Physicochemical phenomena induced by water sorption in flexible printed circuit/glass substrate joints using anisotropic conductive films, M. Inoue, T. Miyamoto and K. Suganuma, 2004.06, Conference Report / Oral Presentation

  183. Influence of lead contamination on reliability of lead free soldered joints, K. Suganuma and K. -S. Kim, 2004.06, Conference Report / Oral Presentation

  184. Effects of composition on microstrcuture and on thermal stability of Sn-Ag-In lead-free soldered joints, K.S. Kim, T. Imanishi, K.Suganuma, S.Kumamoto and M.Aihara, Trans.Mater.Res.Soc.Jpn, 29[5], 2004.05, Papers

  185. Effect of moisture absorption on the reliability of ACF interconnects between FPC and glass substrates, M.Inoue, T.Miyamoto, K.Suganuma, Proc. ICEP 2004, 2004.04, International Conference(Non Proceeding)

  186. Effect of moisture absorbtion on ACF interconnects, M. Inoue, T. Miyamoto, K.Suganuma, 2004.04, Conference Report / Oral Presentation

  187. Analysis of thermal properties of isotropic conductive adhesives by composite theories, T.Sugimura, M.Inoue, M.Yamashita, S.Yamaguchi, K.Suganuma, Journal of Japan Institute of Electronic Packaging, 2004.03, Papers(In Japanese)

  188. Differences in Formation and Growth of Interface Between Sn-Ag and Sn-Ag-Cu Lead-Free Solder with Ni-P/Au Plating, C.-W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, 2004.03, Conference Report / Oral Presentation

  189. Development of New Lead-Free Solder Containing Nano Sized Particles, K.-S. Kim, K. Suganuma,M. Ueshima, 2004.03, Conference Report / Oral Presentation

  190. Solidification phenomenon in CSP soldering with Sn-Ag-Cu lead-free alloy using in situ observation system with computer simulation, K.-S. Kim, J.-M. Kim, K.Suganuma,C.-W. Hwang, 2004.03, Conference Report / Oral Presentation

  191. Effect of Cu addition to Sn-Ag lead-free solder on interfacial stability with Fe-42Ni, C. -W. Hwang and K. Suganuma, Mater. Trans., 45[3] (2004) 714-720, 2004.03, Papers

  192. In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu lead-free alloy, K.-S. Kim, S. -H. Hwuh and K. Suganuma, Microelectronics Reliability, 2003.12, Papers

  193. In-situ observation and simulation on the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy, K. S. Kim, M. Haga, and K. Suganuma, J. Electron. Mater., 32-12. 1483-1489, 2003.12, Papers

  194. Spreading of Sn-Ag solders on Fe-Ni alloys, E. Saiz, C.-W. Hwang, K. Suganuma and A. P. Tomsia, 2003.11, Papers

  195. Interfaces in lead-free soldering, C.-W. Hwang, K.-S. Kim and K. Suganuma, J. Electron. Mater, 2003.11, Papers

  196. Interfaces in lead-free soldering, C. W. Hwang, K. S. Kim, and K. Suganuma, J. Electron. Mater., 32-11, 1249-1256, 2003.11, Papers

  197. Effect of the joining pressure on Ag-epoxy conductive adhesive/Sn interfaces exposed to heat, M. Yamashita and K. Suganuma, 2003.10, Papers

  198. Influence of Ag addition to Sn-Bi eutectic alloy on microstructure and on mechanical properties, K. Suganuma, T. Sakai and K. S. Kim, J. Japan Institute of Electronics Packaging, 6-5, 414-419, 2003.09, Papers(In Japanese)

  199. Wetting and Strength Issues at Al/α-Alumina Interfaces, E. Saiz, A. P. Tomsia, and K. Suganuma, 2003.07, Papers

  200. Interface Microstructure between Fe-42Ni Alloy and Pure Sn, C.W. Hwang, K. Suganuma, J.-G. Lee and H. Mori, J. Mater. Res, 2003.05, Papers

  201. Thermal and mechanical stability of SMT structures soldered with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto and M. Ueshima, 2003.04, Papers

  202. Solderability and Interface Property of Sn-Zn-Bi on Metal Substrates, Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma, 2003.03, Conference Report / Oral Presentation

  203. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, K.-S. Kim, S. -H. Hwuh and K. Suganuma, Microelectronics Reliability, 43(2003), 259-267., 43259-267, 2003.03, Papers

  204. Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating, C. Hwang, J.-G. Lee, K.Suganuma and H. Mori, J. Electron. Mater., 32[2](2003), 52-62., 52-62, 2003.02, Papers

  205. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, K. S. Kim, S. H. Huh, and K. Suganuma, J. Microelectron Reliab., 43-2, 259-267, 2003.02, Papers

  206. Improvement of Properties of Sn-Cu Lead-Free Solder by Third Element Alloying and its Reliability for Through-Hole Circurt Assembry, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Advances in Technology of Materials and Materials Processing Journal (ATM), 2003.01, Papers

  207. A new approach to an artificial joint based on bio-cartilage/porou ricalcium phosphatesystem, Shinsuke Aoki, Shunro Yamaguchi, Atsushi Nakahira and Katsuaki Suganuma, Journal of the European Ceramic Society, 2003.01, Papers

  208. Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints, K.S. Kim, K. Suganuma, T. Shimozaki, C.G. Lee, Materials Science Forum, 2003.01, Papers

  209. Effect of　composition and cooling rate on microstructure and tensile properties of　Sn-Zn-Bi alloys, Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma, J. Alloy. Compd., 2003.01, Papers

  210. Squeeze Casting for Low Cost Fabrication of Advanced Materials and Joints, K. Suganuma, M. Inoue and K. Tanihata, 2003.01, Conference Report / Oral Presentation

  211. Effect of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, K.-S. Kim, S. -H. Hwuh and K. Suganuma, J. Alloys Compounds, 2003.01, Papers

  212. Effect of composition cooling rate on the microstructure and tensile properties of Sn-Zn-Bi solder alloy, Y.-S. Kim, K.-S. Kim, C.-W. Hwang, K. Suganuma, J. Alloys Compounds, 352(1-2) (2003), 237-245, 352(1-2) 237-245, 2003.01, Papers

  213. Improvement of properties of Sn-Cu lead-free solder by third element alloying and its reliability for through-hole circuit assembly, S. H. Huh, K. S. Kim, and K. Suganuma, Advances in Technology of Materials and Materials Processing Journal (ATM), 5-1, 1-6, 2003.01, Papers

  214. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, K. S. Kim, S. H. Huh, and K. Suganuma, J. Alloy. Compd., 352(1-2), 226-236., 2003.01, Papers

  215. Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints, K. S. Kim, K. Suganuma, T. Shimozaki, and C.G. Lee, Materials Science Forum, 439, 7-11, 2003.01, Papers

  216. Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys, Y. S. Kim, K. S. Kim, C. W. Hwang, and K. Suganuma, J. Alloy. Compd., 352(1-2), 237-245, 2003.01, Papers

  217. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, J. Elservier Science, Microelectron Reliab, 2002.12, Papers

  218. Thermal fatigue damage of lead-free soldered through-hole circuit, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Proc. 4th Pacific Rim International Conference on Advanced Materials and Processing, Hawaii.pp.1071-1074, 2002.12, Conference Report / Oral Presentation

  219. Microstructure changes in Sn-Zn/Cu joints during heat-exposure, Keun-Soo Kim, Young-Sun Kim, Katsuaki Suganuma, and Hideo Nakajima, vol. 5 pp.666-671, 2002.11, Papers(In Japanese)

  220. Alloying Design for Lead-Free Soldering, K. Suganuma, Keun-Soo Kim and Chi-Won Hwang, International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka, Japan.pp.25-28, 2002.11, Conference Report / Oral Presentation

  221. Microstructure changes in Sn-Zn/Cu joints during heat-exposure, Keun-Soo Kim, Young-Sun Kim, Katsuaki Suganuma, and Hideo Nakajima, J. Japan Institute of Electronics Packaging, 5-7, 666-671, 2002.11, Papers(In Japanese)

  222. Carburization of TiAl Alloys by Reactive Plasma Process at Elevated Temperatures, Masahiro Inoue, Masanobu Nunogaki, Katsuaki Suganuma, 2002.10, Conference Report / Oral Presentation

  223. Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K.-S. Kim, Y. Takagi, J. Sugimoto and M. Ueshima, IEEE Trans. on Electronics Packaging Manufacturing, 25[4](2002), 257-261., 257-261, 2002.10, Papers

  224. Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, Materials Science and Engineering A, vol. 333 pp.106-114, vol. 333 pp.106-114, 2002.08, Papers

  225. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, K. S. Kim, S. H. Huh, and K. Suganuma, Materials Science and Engineering A, 333(August), 106-114, 2002.08, Papers

  226. Mechanical behavior of reactively hot-pressed FeAl matrix composites with carbide particles at elevated temperatures, Masahiro Inoue, Katsuaki Suganuma, Journal of Materials Science Letters, 2002.07, Papers

  227. Degradation mechanism of Ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure, M. Yamashita and K. Suganuma, journal of electronic materials pp.551-556, pp.551-556, 2002.06, Papers

  228. Joining reliability of Sn-Ag-Cu series solder alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, International Conference on Electronics Packaging (ICEP), Tokyo.pp.89-92, 2002.04, Conference Report / Oral Presentation

  229. Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto, and M. Ueshima, IEEE Trans. Elec. Pack. Manu., 25-4, 257-261, 2002.04, Papers

  230. Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Materials Transactions, JIM, vol. 43 pp.239-245, vol. 43 pp.239-245, 2002.02, Papers

  231. Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder, S. H. Huh, K. S. Kim, and K. Suganuma, Materials Transactions, JIM, 43-2, 239-245, 2002.02, Papers

  232. High temperature stability of lead-free soldering interface, K.Suganuma and C.W.Hwang, Proc. Electronics Goes Green 2000+, ed. By H. Reighl and H.Griese, VDE Verlag, (2000), 67-72., 67-72, 2002.01, Conference Report / Oral Presentation

  233. Structural characterization of the metal/glass interface in bioactive glass coatings on Ti-6Al-4V, T. Oku, K. Suganuma, L. R. Wallenberg, A. P. Tomsia, J. M. Gomez-Vega, E. Saiz, J. Mater. Sci. Mater. Med., Vol. 12, pp. 413-417., Vol. 12, pp. 413-417, 2001.12, Papers

  234. Effect of alloying additives on microstructure and mechanical properties of Sn-Ag-Cu solder alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, Proc. 4th Pacific Rim International Conference on Advanced Materials and Processing, Hawaii.pp.1051-1054, 2001.12, Conference Report / Oral Presentation

  235. The Development and Commercialization of Lead-Free Soldering, K.Suganuma, MRS Belletin, 26 880-884, 26 880-884, 2001.11, Papers

  236. Atomic structure and stability of elliptical onion, H. Kitahara, T. Oku and K. Suganuma, European Physical Journal D, Vol. 16, pp. 361-363., Vol. 16, pp. 361-363, 2001.10, Papers

  237. Synthesis, atomic structures and arrangement of carbon and boron nitride nanocage materials, T. Oku, H. Kitahara, M. Kuno, I. Narita and K. Suganuma, Scripta Materialia, Vol. 44, pp. 1557-1560., Vol. 44, pp. 1557-1560, 2001.09, Papers

  238. Synthesis of boron nitride nanotubes and nanocapsules with LaB6, M. Kuno, T. Oku and K. Suganuma, Diamond and Related Materials, Vol. 10, pp. 1231-1234., Vol. 10, pp. 1231-1234, 2001.06, Papers

  239. High-resolution electron microscopy and structural optimization of C36, B36N36 and Fe@B36N36 clusters, Takeo Oku and Katsuaki Suganuma, Diamond and Related Materials, Vol. 10, pp. 1205-1209., Vol. 10, pp. 1205-1209, 2001.06, Papers

  240. Synthesis and characterization of cobalt nanoparticles encapsulated in boron nitride nanocages, H. Kitahara, Takeo Oku, T. Hirano and K. Suganuma, Diamond and Related Materials, Vol. 10, pp. 1210-1213., Vol. 10, pp. 1210-1213, 2001.06, Papers

  241. Formation and atomic structure of tetrahedral carbon onion, I. Narita, T. Oku, K. Suganuma, K. Hiraga and E. Aoyagi, Journal of Materials Chemistry, Vol. 11, pp. 1761-1762., Vol. 11, pp. 1761-1762, 2001.05, Papers

  242. Effect of Ag addition on the microstructural and mechanical properties of Sn-Cu eutectic solder, S. H. Huh, K. S. Kim, and K. Suganuma, Materials Transactions, JIM, 42-5, 739-744, 2001.05, Papers

  243. Microstructure and Mechanical Properties of Sn-Bi Eutectic Alloy with Ag Addition as Low-temperature Lead-free Solder, Taiji Sakai and Katsuaki Suganuma, pp.~393-396, 2001.02, Conference Report / Oral Presentation (In Japanese)

  244. Chemical Reaction of TiAl Intermetallics with a Nitrogen Plasma, Masahiro Inoue, Masanobu Nunogaki, and Katsuaki Suganuma, Journal of Solid State Chemistry, Vol.~157, No.~2, pp.~339-346, Vol.~157, No.~2, pp.~339-346, 2001.02, Papers

  245. Effect of Ag Content on Properties of Sn-Ag Binary Alloy Solder, Katsuaki Suganuma, Seok-Hwan Huh, Keun-Soo Kim, Hirohumi Nakase, and Yoshikazu Nakamura, Materials Transactions JIM, Vol.~42, No.~2, pp.~286-291, Vol.~42, No.~2, pp.~286-291, 2001.02, Papers

  246. Effect of Ag on microstructure and mechanical properties of Sn-Cu eutectic solder, S-H. Huh, K-S. Kim and K. Suganuma, Material.Trans. JIM, 42 739-744, 42 739-744, 2001.02, Papers

  247. Effect of Ag content on properties of Sn-Ag binary alloy solder, K. Suganuma, S. H. Huh, K. S. Kim, H. Nakase, and Y. Nakamura, Materials Transactions, 42-2, 286-291, 2001.02, Papers

  248. Advances in Lead-free Electronics Soldering, Katsuaki Suganuma, Current Opinion in Solid State and Materials Science, Vol.~5, No.~1, pp.~555-564, Vol.~5, No.~1, pp.~555-564, 2001.01, Papers

  249. Squeeze casting for processing advanced materials, K.Suganuma, Recent Research Developments in Materials Science 2 19-26., 2 19-26, 2001.01, Papers

  250. Novel Bioactive Functionally Graded Coatings on Ti6Al4V, Jose Gomez-Vega, Eduardo Saiz, Antoni Tomsia (Lawrence Berkeley Laboratory), Takeo Oku, Katsuaki Suganuma, Grayson Marshall (Lawrence Berkeley Laboratory), and Sally Marshall (Lawrence Berkeley Laboratory), Advanced Materials, Vol.~12, No.~12, pp.~891-898, Vol.~12, No.~12, pp.~891-898, 2000.12, Papers

  251. Carbon Nanocage Structures Formed by One-dimensional Self-organization of Gold Nanoparticles, Takeo Oku and Katsuaki Suganuma, Chemical Communications, No.~23, pp.~2355-2356, No.~23, pp.~2355-2356, 2000.12, Papers

  252. Lift-off Phenomenon in Wave Soldering, Katsuaki Suganuma, Minoru Ueshima, Itsuro Ohnaka, Hideyuki Yasuda, Jin Dong Zhu, and Takanori Matsuda, Acta Materialia, Vol.~48, No.~18/19, pp.~4475-4481, Vol.~48, No.~18/19, pp.~4475-4481, 2000.12, Papers

  253. Environmental Effect on Mechanical Properties of Aluminide Matrix Composites, Masashi Inoue, Katsuaki Suganuma, and Koichi Niihara, J. Mater.~Eng.~Perform, Vol.~9, No.~6, pp.~678-682, Vol.~9, No.~6, pp.~678-682, 2000.12, Papers

  254. Reaction Interface of $\beta$-Si$_3$N$_4$ Whisker/Al-Mg-Si, Katsuaki Suganuma, Vol.~39, No.~12, p.~980, 2000.12, Review Papers(In Japanese)

  255. Mechanism and Prevention of Lift-off in Lead-free Soldering, Katsuaki Suganuma, Proceedings of the 33rd International Symposium on Microelectronics (IMAPS2000), pp.~303-307, pp.~303-307, 2000.09, Conference Report / Oral Presentation

  256. High Temperature Stability of Lead-free Soldering Interface, Katsuaki Suganuma and Chi-Won Hwang, Proceedings of the Electronics Goes Green 2000+, pp.~67-72, pp.~67-72, 2000.09, Conference Report / Oral Presentation

  257. Mechanical Properties of Aluminide Matrix Composites Fabricated by Reactive Hot-pressing in Several Environments, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Intermetallics, Vol.~8, No.~9-11, pp.~1035-1042, Vol.~8, No.~9-11, pp.~1035-1042, 2000.09, Papers

  258. Mechanical Properties of Aluminide Matrix Composites Fabricated by Reactive Hot-pressing in Several Environments, Masashi Inoue, Katsuaki Suganuma, and Koichi Niihara, Intermetallics, Vol.~8, No.~9-11, pp.~1035-1042, Vol.~8, No.~9-11, pp.~1035-1042, 2000.09, Papers

  259. One-dimensional Positioning of Carbon Nanocapsules and Spontaneous Formation of Carbon Nanotubes by Self-organization of Gold Nanoparticles, Takeo Oku and Katsuaki Suganuma, Microelectron Engineering, Vol.~51-52, pp.~51-60, Vol.~51-52, pp.~51-60, 2000.07, Papers

  260. Fabrication and Magnetic Properties of Boron Nitride Nanocapsules Encaging Iron Oxide Nanoparticles, Takanori Hirano, Takeo Oku, and Katsuaki Suganuma, Diamond and Related Materials, Vol.~9, pp.~476-479, Vol.~9, pp.~476-479, 2000.07, Papers

  261. Formation and Properties of Boron Nitride Nanocapsules with Metal and Semiconductor Nanoparticles, Takanori Hirano, Takeo Oku, Masayuki Kawaguchi (Osaka Electro-Communication University), and Katsuaki Suganuma, Molecular Crystals and Liquid Crystals, Vol.~340, pp.~787-792, Vol.~340, pp.~787-792, 2000.07, Papers

  262. Atomic Structures and Electronic States of Boron Nitride Fullerene and Nanotubes, Takanori Hirano, Takeo Oku, and Katsuaki Suganuma, Diamond and Related Materials, Vol.~9, pp.~625-628, Vol.~9, pp.~625-628, 2000.07, Papers

  263. Formation and Photoluminescence of Ge and Si Nanoparticles with Oxide Layers, Takeo Oku, Tadachika Nakayama, Masaki Kuno, Yasuo Nozue, Lars Reine Wallenberg (Lund University), Koichi Niihara, and Katsuaki Suganuma, Materials Science and Engineering B, Vol.~74, pp.~242-247, Vol.~74, pp.~242-247, 2000.07, Papers

  264. Structure of Pd-intercalated Graphite Onions Formed by Electron Beam Irradiation, Takeo Oku, Gunter Schmid (University GH Essen), Katsuaki Suganuma, Qiang Sun (Tohoku University), and Yoshiyuki Kawazoe (Tohoku University), Molecular Crystals and Liquid Crystals, Vol.~340, pp.~95-100, Vol.~340, pp.~95-100, 2000.07, Papers

  265. Formation and Structure of Cluster-included Carbon Nanocapsules Prepared by Polymer Pyrolysis, Takeo Oku, Takanori Hirano, Satoru Nakajima (Akita National College of Technology), Katsuaki Suganuma, Eiji Aoyagi (Tohoku University), and Kenji Hiraga (Tohoku University), Molecular Crystals and Liquid Crystals, Vol.~340, pp.~799-804, Vol.~340, pp.~799-804, 2000.07, Papers

  266. Formation and Structure of Ag, Ge and SiC Nanoparticles Encapsulated in Boron Nitride and Carbon Nanocapsules, Takeo Oku, Takafumi Kusunose, Takamichi Hirata (Tohoku University), Rikizo Hatakeyama (Tohoku University), Noriyoshi Sato (Ibaraki University), Koichi Niihara, and Katsuaki Suganuma, Diamond and Related Materials, Vol.~9, No.~3-7, pp.~911-915, Vol.~9, No.~3-7, pp.~911-915, 2000.07, Papers

  267. Synthesis,Atomic Structures and Properties of Carbon and Boron Nitride Fullerene Materials, Takeo Oku,Takanori Hirano, Masaki Kuno, Takafumi Kusunose, Koichi Niihara, and Katsuaki Suganuma, Materials Science and Engineering B, Vol.~74, pp.~206-217, Vol.~74, pp.~206-217, 2000.06, Papers

  268. Environmental Effect on Mechanical Properties of Aluminide Matrix Composites, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Journal of Materials Engineering and Performance, Vol.~9, No.~6, pp.~678-682, Vol.~9, No.~6, pp.~678-682, 2000.06, Papers

  269. Formation and Photoluminescence of Ge and Si Nanoparticles Encapsulated in Oxide Layers, Takeo Oku, Tadachika Nakayama, Masaki Kuno, Yasuo Nozue, L. Reine Wallenberg, Koichi Niihara, and Katsuaki Suganuma, Mater.~Sci.~Eng.~B, Vol.~74, No.~1-3, pp.~242-247, Vol.~74, No.~1-3, pp.~242-247, 2000.05, Papers

  270. Synthesis, Atomic Structures and Properties of Carbon and Boron Nitride Fullerene Materials, Takeo Oku, Takanori Hirano, Masaki Kuno, Takafumi Kusunose, Koichi Niihara, and Katsuaki Suganuma, Mater.~Sci.~Eng.~B, Vol.~74, No.~1-3, pp.~206-217, Vol.~74, No.~1-3, pp.~206-217, 2000.05, Papers

  271. Fracture Mechanism of Ni$_3$Al Alloys and Their Composites with Ceramics with Ceramic Particles at Elevated Temperatures, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Intermetallics, Vol.~8, No.~4, pp.~365-370, Vol.~8, No.~4, pp.~365-370, 2000.04, Papers

  272. Heat Resistance of Sn-9Zn Solder/Cu Interface with or without Coating, Katsuaki Suganuma, Toshikazu Murata (Matsushita Battery Industrial Co.,Ltd.), Hirogi Noguchi (Matsushita Electric Co.,Ltd.), and Yoshitaka Toyoda (Senju Metal Industry Co.,Ltd.), Journal of Materials Research, Vol.~15, No.~4, pp.~884-891, Vol.~15, No.~4, pp.~884-891, 2000.04, Papers

  273. Formation and Structure of Nanoparticles Encapsulated in Boron Nitride and Carbon Nanocapsules, Takeo Oku, Takafumi Kusunose, Takamichi Hirata, Noryoshi Sato, Rikizo Hatakeyama, Koichi Niihara, and Katsuaki Suganuma, Diamond and Related Materials, Vol.~9, No.~3-6, pp.~911-915, Vol.~9, No.~3-6, pp.~911-915, 2000.04, Papers

  274. Fracture Mechanism of Ni$_3$Al Alloys and Their Composites with Ceramic Particles at Elevated Temperatures, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Intermetallics, Vol.~8, No.~4, pp.~365-370, Vol.~8, No.~4, pp.~365-370, 2000.04, Papers

  275. Advances in Lead-Free Soldering, Katsuaki Suganuma, Vol.~42, No.~4, pp.~36-42, 2000.04, Review Papers(In Japanese)

  276. Trends in Lead-Free Electronics Packaging, Katsuaki Suganuma, Vol.~, No.~4, pp.~56-63, 2000.04, Review Papers(In Japanese)

  277. High Reliability Lead-Free Electronics Packaging, Katsuaki Suganuma, Vol.~13, No.~4, pp.~91-97, 2000.04, Review Papers(In Japanese)

  278. Encapsulation of Co Nanoparticles in BN Nanocapsules and Synthesis of BN Nanotubes by Arc-melting Method, Masaki Kuno, Takeo Oku, and Katsuaki Suganuma, Proceedings of the SANKEN International Symposium, Advanced Nanoelectronics: Devices, Materials and Computing 3, pp.~183-184, 3, pp.~183-184, 2000.03, Conference Report / Oral Presentation

  279. Formation,Structure and Properties of BN Fullerene Materials, Takanori Hirano, Takeo Oku, and Katsuaki Suganuma, Proceedings of the SANKEN International Symposium, Advanced Nanoelectronics: Devices, Materials and Computing 3, pp.~181-182, 3, pp.~181-182, 2000.03, Conference Report / Oral Presentation

  280. Gold Nanowires and Nanodots in Carbon Nanotube-capsules Formed by One-dimensional Self-organization of Gold Nanoparticles, Takeo Oku and Katsuaki Suganuma, Proceedings of the SANKEN International Symposium, Advanced Nanoelectronics: Devices, Materials and Computing 3, pp.~244-245, 3, pp.~244-245, 2000.03, Conference Report / Oral Presentation

  281. Interfacial Structure of $\beta$-Silicon Nitride Whisker Reinforced 7075 Aluminum Alloy Composite, Mitsuhiro Tokuse (UBE Research Laboratory), Tohru Matsubara (UBE Research Laboratory), Katsuaki Suganuma, and Ichiro Namamura (Tokushima University), Vol.~51, No.~1, pp.~51-55, 2000.01, Papers(In Japanese)

  282. Machanism of Lift-off Phenomenon, Katsuaki Suganuma, Itsuo Ohnaka, Hideyuki Yasuda, and Zingdong Zhu, Vol.~38, No.~12, pp.~927-932, 1999.12, Review Papers(In Japanese)

  283. Mechanism of Lift-Off Phenomenon, Katsuaki Suganuma, Itsuo Ohnaka, Yukihide Yasuda, and JinDong Zhu, Vol.~38, No.~12, pp.~927-932, 1999.12, Review Papers(In Japanese)

  284. Special Issue on Lead-Free Electronics Packaging, Katsuaki Suganuma, Vol.~38, No.~12, p.~919, 1999.12, Review Papers(In Japanese)

  285. Lead-Free Electronics Packaging, Katsuaki Suganuma, Vol.~50, No.~12, pp.~1063-1070, 1999.12, Review Papers(In Japanese)

  286. Carbon Nanocage Structures Formed by One-Dimensional Self-Organization of Gold Nanoparticles, Takeo Oku and Katsuaki Suganuma, Chemical Communication, Vol.~23, pp.~2355-2356, Vol.~23, pp.~2355-2356, 1999.12, Papers

  287. Formation and Structure of Carbon Nanocage Structures Produced by Polymer Pyrolysis and Electron-Beam Irradiation, Takeo Oku, Takanori Hirano, Satoru Nakajima (Tohoku University), and Katsuaki Suganuma, Journal of Materials Research, Vol.~14, pp.~4266-4273, Vol.~14, pp.~4266-4273, 1999.12, Papers

  288. Atomic Structure of Pd-Intercalated Graphite by High-Resolution Electron Microscopy and First Principles Calculations, Takeo Oku, Qiang Sun (Tohoku University), Ding-Sheng Wang (Tohoku University), Qian Wang (Tohoku University), Yoshiyuki Kawazoe (Tohoku University), Gunter Schmid (Essen University), and Katsuaki Suganuma, Matererials Transactions of Japan Institute of Metals, Vol.~40, pp.~1213-1218, Vol.~40, pp.~1213-1218, 1999.11, Papers

  289. Research and Development for Lead-Free Soldering in Japan, Katsuaki Suganuma, 1999.10, Review Papers

  290. Nano-Structure and Interface as Keywords-Two Big Applications-, Katsuaki Suganuma, Vol.~15, No.~10, pp.~2-8, 1999.10, Review Papers(In Japanese)

  291. Formation And Structure Of C-B-N Fulleren Materials, Takeo Oku, Takanori Hirano, and Katsuaki Suganuma, Vol.~12, No.~8, pp.~41-46, 1999.08, Review Papers(In Japanese)

  292. B-C-N Fulleren Materials, Takeo Oku, Takanori Hirano, and Katsuaki Suganuma, Vol.~15, No.~9, pp.~15-20, 1999.08, Review Papers(In Japanese)

  293. Possible Detection of Doping Atoms in C60 Solid Clusters by High-Resolution Electron Microscopy, Takeo Oku, Hiroshi Kubota (Kumamoto Univerisity), Takeshi Ohgami (Kumamoto Univerisity), and Katsuaki Suganuma, Carbon, Vol.~37, pp.~1299-1309, Vol.~37, pp.~1299-1309, 1999.08, Papers

  294. Intermetallic Matrix Composites Designing, Masahiro Inoue and Katsuaki Suganuma, Vol.~34,No.~6,pp.~450-454, 1999.06, Review Papers(In Japanese)

  295. Fracture Mechanism of FeAl Matrix Composites with Discontinuous Ceramic Reinforcements, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Matererials Science and Engineering, A265, 240-245, A265, 240-245, 1999.06, Papers

  296. Formation of Gold and Iron Oxide Nanoparticles Encapsulated in Boron Nitride Sheets, Takanori Hirano, Takeo Oku, and Katsuaki Suganuma, Journal of Matererials Chemistry, Vol.~9, pp.~855-857, Vol.~9, pp.~855-857, 1999.05, Papers

  297. Nanostructural Characterization of Solid Clusters and Oxide by HREM with Residual Indices, Takeo Oku, Jan-Olov Bovin (Lund University), Satoru Nakajima (Tohoku University), Hiroshi\- Kubota (Kumamoto University), Takeshi Ohgami (Kumamoto University), and Katsuaki Suganuma, Nanostructured Materials, Vol.~12, pp.~563-566, Vol.~12, pp.~563-566, 1999.05, Papers

  298. Mechanical Properties of Aluminide Intermetallic Matrix Composites Reinforced with Ceramic Fibers, Masahiro Inoue and Katsuaki Suganuma, Vol.~37, No.~4, pp.~230-233, 1999.04, Review Papers(In Japanese)

  299. Lead-Free Soldering Progress in Electronics Packaging, Katsuaki Suganuma, Vol.~12,No.~4, pp.~192-196, 1999.04, Review Papers(In Japanese)

  300. Influence of Various Factors on Lift-off Phenomenon in Wave Soldering with Sn-Bi Alloy, Katsuaki Suganuma, Vol.~2, 116-120, 1999.02, Papers(In Japanese)

  301. Research and Development of Lead-free Soldering and Problems, Katsuaki Suganuma, Vol.~2, 51-57, 1999.01, Review Papers(In Japanese)

  302. High Cost-performance Ceramic/Metal Composites by Casting, Katsuaki Suganuma, Vol.~12, No.~1, pp.~23-31, 1999.01, Review Papers(In Japanese)

  303. Microstructure and Fracture Strength of TiN/Al and Al Alloys Interface, Minoru Ueshima, Takeo Oku, Masahiro Inoue, Kimiaki Tanihata, Masao Takahashi, and Katsuaki Suganuma, Key Eng. Mater., 161-163 (1999) 667-670., 161-163 667-670, 1999.01, Papers

  304. Advances in Lead-free Soldering, Katsuaki Suganuma, Vol.~11, No.~12, pp.~21-30, 1998.12, Review Papers(In Japanese)

  305. Structure of Nanocapsules --- Control of Nanospace ---, Takeo Oku, Katsuaki Suganuma, and Takanori Hirano, Vol.~37, No.~12, p.~1016, 1998.12, Review Papers(In Japanese)

  306. Toughening Mechanism of Ni$_3$Al Alloys by B Doping, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Journal of Materials Science Letters, Vol.~17, pp.~1967-1969, Vol.~17, pp.~1967-1969, 1998.12, Papers

  307. Fracture Properties of Fe-40at\% Al Matrix Composites Reinforced with Ceramic Particles and Fibers, Masahiro Inoue, Hideki Nagao (National Defense Academy), Katsuaki Suganuma, and Koichi Niihara, Materials Science and Engineering A, Vol.~258, pp.~298-305, Vol.~258, pp.~298-305, 1998.11, Papers

  308. Fracture Properties of Fe-40at\% Al Alloys Fabricated by Reactive Hot-pressing, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Scripta Materialia, Vol.~39, pp.~1477-1482, Vol.~39, pp.~1477-1482, 1998.10, Papers

  309. Fabrication of Ceramic-Metal Composite by Pressure Infiltration of Metal to Porous Ceramics, Kimiaki Tanihata and Katsuaki Suganuma, Key Engineering Materials, Vol.~161-163, pp.~259-262, Vol.~161-163, pp.~259-262, 1998.10, Papers

  310. Research Trends of lead-free Soldering, Katsuaki Suganuma, Vol.~14, No.~9, pp.~54-63, 1998.09, Review Papers(In Japanese)

  311. Effects of Boron Doping on Fracture Properties of Ni$_3$Al Matrix Composites with Ceramic Particles, Masahiro Inoue, Kei Takahashi (National Defense Academy), Katsuaki Suganuma, and Koichi Niihara, Scripta Materialia, Vol.~39, pp.~887-892, Vol.~39, pp.~887-892, 1998.09, Papers

  312. Effects of Boron Doping on Fracture Properties of Ni$_{3}$Al Matrix Composites with Ceramic Particles, Masashi Inoue, Koji Takahashi, Katsuaki Suganuma, and Koichi Niihara, Scr.~Mater., Vol.~39, No.~7, pp.~887-892, Vol.~39, No.~7, pp.~887-892, 1998.09, Papers

  313. Possible Detection of Doping Atoms in B$_{12}$ and C$_{60}$ Solid Clusters, Takeo Oku, Jan-Olov Bovin (Lund University, Sweden), Hiroshi Kubota (Kumamoto University),\- Takeshi Ohgami (Kumamoto University), and Katsuaki Suganuma, Proceedings of International Congress on Electron Microscopy, Vol.~14, pp.~387-388, Vol.~14, pp.~387-388, 1998.08, Conference Report / Oral Presentation

  314. HREM of Carbon Nanocapsules with Nanoparticles, Takeo Oku, Gunter Schmid (Essen University, Germany), Koichi Niihara, and Katsuaki Suganuma, Proceedings of International Congress on Electron Microscopy, Vol.~14, pp.~91-92, Vol.~14, pp.~91-92, 1998.08, Conference Report / Oral Presentation

  315. Formation of Carbon Onions with Pd Clusters in High-resolution Electron Microscope, Takeo Oku, Gunter Schmid (Essen University, Germany), and Katsuaki Suganuma, Journal of Materials Chemistry, Vol.~8, pp.~2113-2117, Vol.~8, pp.~2113-2117, 1998.08, Papers

  316. Formation of Carbon Nanocapsules with SiC Nanoparticles Prepared by Polymer Pyrolysis, Takeo Oku, Koichi Niihara, and Katsuaki Suganuma, Journal of Materials Chemistry, Vol.~8, pp.~1323-1325, Vol.~8, pp.~1323-1325, 1998.05, Papers

  317. Formation and Structure of Nano-Intermaterials, Takeo Oku, Katsuaki Suganuma, and Gunter Schmid (Essen University, Germany), Proceedings of the SANKEN Int.~Symp.~, Vol.~1, pp.~165-166, Vol.~1, pp.~165-166, 1998.04, Conference Report / Oral Presentation

  318. Microstructural Features of Lift-off Phenomenon in Through-hole Circuit Soldered by Sn-Bi Alloy, Katsuaki Suganuma, Scripta Materialia, Vol.~38, pp.~1333-1340, Vol.~38, pp.~1333-1340, 1998.04, Papers

  319. Wetting and Interface Microstructure between Sn-Zn Binary Alloys and Cu, Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku~(National Defense Academy), and Yoshikazu Nakamura (National Defense Academy), Journal of Materials Research, Vol.~13, pp.~2859-2865, Vol.~13, pp.~2859-2865, 1998.04, Papers

  320. Guideline for development of aluminide matrix composites with high performance, Masahiro Inoue and Katsuaki Suganuma, Vol. 14, No. 3, pp. 39-45, 1998.03, Review Papers(In Japanese)

  321. Processing and Fracture Properties of Fe-40at\%Al Matrix Composites, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Abstract of Annual meeting of TMS, pp. 232-233, pp. 232-233, 1998.02, Conference Report / Oral Presentation

  322. Synthetic Properties of Unform Nickel Aluminides by Reactive Infiltration and Post Hot-Pressing of Infiltrated Precursors, Masahiro Inoue, Hideyoshi Watanabe (National Defense Academy), Koichi Niihara, and Katsuaki Suganuma, Mater. Letters, Vol. 34, No. 2, pp. 55-59, Vol. 34, No. 2, pp. 55-59, 1998.02, Papers

  323. Microstructure and Mechanical Properties of Reactive-hot-pressed Nickel Aluminide Matrix Composites, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Proceedings of the 5th Japan International SAMPE Symp. , pp. 469-474, pp. 469-474, 1997.10, Conference Report / Oral Presentation

  324. Fracture Toughness of Reactive-Hot-Pressed Iron Aluminide Matrix Composites, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Abstract of IUMRS-ICA97, p. 742, p. 742, 1997.09, Conference Report / Oral Presentation

  325. Lead Free Soldering, Katsuaki Suganuma, Vol.12, No.3, pp.83-89, 1997.07, Review Papers(In Japanese)

  326. Mechanical Behavior of Reactively Hot-Pressed Alminide Matrix Composites, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Mat. Res. Soc. Symp. Proc., Vol. 460, pp. 755-759, Vol. 460, pp. 755-759, 1997.06, Conference Report / Oral Presentation

  327. Interface of Aluminum/Ceramic Power Substrates Manufactured by Casting-Bonding Process, Xiao S. Ning and Katsuaki Suganuma, Mat. Res. Soc. Symp. Proc., Vol. 445, pp. 101-106, Vol. 445, pp. 101-106, 1997.06, Conference Report / Oral Presentation

  328. Ceramic/Metal Joining and Interfaces, Katsuaki Suganuma, Proc. Inter. Conf. on Materials Technology : Recent Developments and Future Potentials, Thailand, pp. 96-105, pp. 96-105, 1997.04, Conference Report / Oral Presentation

  329. When Should We Stop Using Solders?, Katsuaki Suganuma, Vol. 13, No. 4, pp. 22-29, 1997.04, Review Papers(In Japanese)

  330. Joints of Ceramics and Metals, Katsuaki Suganuma, Vol. 42, No. 1, pp. 53-58, 1997.04, Review Papers(In Japanese)

  331. Properties of Sn-Bi Solders and its Interface with Cu, Katsuaki Suganuma, Koichi Niihara, Tatsumi Moritou, Yoshikazu Nakamura (National Defense Academy), Vol. 12, No. 1, pp. 406-412, 1997.04, Papers(In Japanese)

  332. Interface Microstructures of Si$_3$N$_4$/Fe and Fe-Cr Alloys Joints, Stathis D. Peteves (JRC Netherland) and Katsuaki Suganuma, Interface Science, Vol. 5, No. 1, pp. 63-72, Vol. 5, No. 1, pp. 63-72, 1997.04, Papers

  333. Development of Pb-free Solders, Katsuaki Suganuma, Vol. 12, No. 3, pp. 83-89, 1997.03, Review Papers(In Japanese)

  334. Ceramic/Metal Joining and Interfaces, Katsuaki Suganuma, Proceedings of Inter. Conf. on Materials Technology: Recent Developments and Future Potentials, Materials Science Centre, pp.96-105, pp.96-105, 1997.01, Conference Report / Oral Presentation

  335. Properties of Sn-Ag Binary Alloys as Lead Free Solder and Interface Microstructure with Cu, Hirofumi Nakase, Katsuaki Suganuma and Yoshikazu Nakamura, Vol.11, No.7, pp.506-509, 1996.12, Papers(In Japanese)

  336. Joining of Ceramics and Metals, Katsuaki Suganuma, Vol.14, No.10, pp.262-270, 1996.10, Review Papers(In Japanese)

  337. 鉛フリーはんだとしてのSn-Ag2元合金の特性とCuとの界面組織, 中瀬裕文，菅沼克昭，中村義一, 第1回エレクトロニクスにおける環境技術；ECEE'96シンポジウム論文集, 回路実装学会, pp.87-90, pp.87-90, 1996.07, Conference Report / Oral Presentation

  338. Fabrication Condition of FeAl by Reactive Sintering and Squeeze Casting Processes, Masahiko Inoue, Yuichiro Itoh and Katsuaki Suganuma, Vol.46, No.7, pp.327-333, 1996.07, Papers(In Japanese)

  339. Microstructure and Strength of Interface between Sn-Ag alloy and Cu, SUGANUMA Katsuaki, 59/,1299, 1995, Papers

  340. Interfacial Microstructures of Potassium Titanate Whiskev in pure Aluminum and 6061 Alloy Matrix, SUGANUMA Katsuaki, 58/,1213, 1994, Papers

  341. Interfaces in β-SiC/6061 aluminum Composites, SUGANUMA Katsuaki, 8/,2569, 1993, Papers

  342. Strength and Microstructure of Silicon Nitride/Aluminum Interface Fabricated by SQ Brazing, SUGANUMA Katsuaki, 11/,43, 1993, Papers

  343. Reaction and Microstructure of Aluminum Borate Whiskev/Aluminum Alloy, SUGANUMA Katsuaki, 41/,297, 1991, Papers

  344. New Process for Brazing Ceramics Utilizing Squeeze Casting, SUGANUMA Katsuaki, 26/,6144, 1991, Papers

  345. Influence of Shape and Size on Residual Stress in Ceramic/Metal Joining(共著), SUGANUMA Katsuaki, 22/,2702, 1987, Papers

  346. Effect of Surface Damage on Strengths of Silicon Nitride Bonded with Aluminum(共著)., SUGANUMA Katsuaki, 1/,356, 1986, Papers

  347. Acoustic Emission from Ceramic/Metal Joints on Cooling(共著), SUGANUMA Katsuaki, 65/,1060, 1986, Papers

  348. Solid-state Bonding of Oxide Ceramic to Steels(共著), SUGANUMA Katsuaki, 133-134/,773, 1985, Papers

  349. Progress of Aluminum Matrix Composites, Katsuaki Suganuma, Vol.~6, No.~31, pp.~145-151, 1905.06, Review Papers(In Japanese)

  350. Lead-Free Soldering in Electronics, Katsuaki Suganuma, No.~6,pp.~150-157, 1905.06, Review Papers(In Japanese)

  351. Lead-Free Electronics Packaging Guide Book, Katsuaki Suganuma, pp.~15-25, 1905.06, Review Papers(In Japanese)

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