Academic Papers

Division display  161 - 180 of about 351 ／  All the affair displays >>

  1. Friction-activated capillary soldering for hermetic seal of vacuum glazing; joining of a pair of glass sheets with lead-free solder, K. Sakaguchi, S. Domi, and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  2. Formation of hydroxyapatite from mechanochemically treated β-tricalcium bis (orthophosphate), M. Kaneno, K. Sakamoto, S. Yamaguchi, and K.Suganuma, 2004.11, Conference Report / Oral Presentation

  3. Fabrication and applications of nano-metal particle composites by ultrasonic eco-process, Y. Hayashi, Y. Saijo, T. Sekino, K. Suganuma, K. Niihara, 2004.11, Conference Report / Oral Presentation

  4. Effect of alumna structure on thermal properties of alumina/aluminum composite formed by freeze and dry process and partial sintering process, M. Nakata and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  5. Synthesis and characterization of calcium phosphate-AMP composite material, M. Kaneno, K. Sakamoto, H. Nakayama, S. Yamaguchi and K. Suganuma, 2004.11, Conference Report / Oral Presentation

  6. Lead-free interconnects engineering in electronics packaging, K. Suganuma, K. S. Kim, and C. H. Hwang, 2004.11, Conference Report / Oral Presentation

  7. Lead-free soldering statues and projects of Japan, 菅沼克昭, 2004.11, Conference Report / Oral Presentation

  8. Lead-free soldering status and projects of Japan, K. Suganuma, 2004.11, Conference Report / Oral Presentation

  9. Effects of composition on microstructure and on thermal stability of Sn-Ag-In lead-free soldered joints, K. S. Kim, T. Imanishi, K. Suganuma, S. Kumamoto, and M. Aihara, Trans. MRS-J, 29-5, 2005-2008, 2004.10, Papers

  10. Interconnect Reliability of Anisotropic Conductive Adhesives for Advanced Electronics Packaging Technologies, M. Inoue and K. Suganuma, 2004.10, Conference Report / Oral Presentation

  11. Influence of Cu Addition to Interface Microstructure between Sn-Ag Solder and Au/Ni-6P Plating, C.-W. Hwang, K. Suganuma M. Kiso and S. Hashimoto, J. Electron.Mater., 33 [10] (2004) 1200-1209, 2004.10, Papers

  12. Thermal and humid stability of Sn-Ag-In lead-free soldered joints, T. Imanishi, K. S. Kim, K. Suganuma, Proceedings of MES2004, The 14th Micro Electronics Symposium, 229-232, 2004.10, Conference Report / Oral Presentation (In Japanese)

  13. Fracture pattern of solder joints with Sn-Zn lead-free solders after thermal exposure (in Japanese), Y. S. Kim, K. S. Kim, K. Suganuma, Proceedings of MES2004, The 14th Micro Electronics Symposium, 213-216, 2004.10, Conference Report / Oral Presentation (In Japanese)

  14. Eco-fabrications and applications of noble metal nano-particles by ultrasound, Y. Hayashi, M. Inoue, K. Niihara, K. Suganuma, Proc. Polytronic 2004, 2004.09, Conference Report / Oral Presentation

  15. Analysis of influential factors in determining adhesive strength of ACF joints, M. Inoue, T. Miyamoto, K. Suganuma, Proc. Polytronic 2004, 2004.09, Conference Report / Oral Presentation

  16. Effects of composition on microstrcuture and on thermal stability of Sn-Ag-In lead-free soldered joints, K.S. Kim, T. Imanishi, K.Suganuma, S.Kumamoto and M.Aihara, Trans.Mater.Res.Soc.Jpn, 2004.09, Papers

  17. Next generation of lead-free solders: Low temperature solders, K. Suganuma, K.-S. Kim, K. Toyofuku, K. Hagio, 2004.09, Conference Report / Oral Presentation

  18. Nano paste and new interconnection technology, K. Suganuma, M. Hayashi, K. -S. Kim, S. Yamaguchi and M. Hatamura, 2004.09, Conference Report / Oral Presentation

  19. Formation mechanisms of various solidification defects in lead-free soldering and their prevention, K. Suganuma and K. -S. Kim, 2004.09, Conference Report / Oral Presentation

  20. Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films, M. Inoue, T. Miyamoto, K. Suganuma, Proc. The sixth IEEE CPMT Conferemce on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04),248-253, 248-253, 2004.06, International Conference(Non Proceeding)

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