Academic Papers

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  1. Temperature dependence of electrical resistivity of isotropic conductive adhesive composed of an epoxy-based binder, M. Inoue, H. Muta, S. Yamanaka, K. Suganuma, 2007.06, International Conference(Proceedings)

  2. Ink-jet printing of Nano Materials and Process for Electronics Applications, K. Suganuma, D. Wakuda, M. Hatamura, K.S. Kim,, 2007.06, International Conference(Proceedings)

  3. A super-flexible sensor system for humanoid robots and related applications, M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, H. Ishiguro,, 2007.04, International Conference(Proceedings)

  4. Sn-Zn low temperature solder, *K. Suganuma, K.S. Kim, J. Materials Science: Materials in Electronics, 18 1-3. 121-127, 2007.03, Papers

  5. Solder electromigration in Cu/In/Cu flip chip joint system, *K. Yamanaka, Y. Tsukada, K. Suganuma, J. Alloys and Compounds, 437 1-2. 186-190, 2007.02, Papers

  6. Dissolution of copper on Sn-Ag-Cu system lead free solder, *G. Izuta, T. Tanabe, K. Suganuma, Soldering & Surface Mount Technology, 19 2 4-11., 2007.02, Papers

  7. Process development and application of noble metal nanoparticle related materials by total eco-design, Y. Hayashi, D. Ishikawa, H. Takizawa, M. Inoue, K. Suganuma, K. Niihara, 粉体および粉末冶金, 54 3 186-193, 2007.01, Papers

  8. Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder, J.E. Lee, K.S. Kim, K. Suganuma, M. Inoue, G. Izuta, Materials Transactions, 48 3 584-593, 2007.01, Papers

  9. Formation and atomic structures of boron nitride nanotubes with cup-stacked and Fe nanowire encapsulated structures, T. Oku, N. Koi, I. Narita, K. Suganuma, Materials Transactions, 48 4 722-729, 2007.01, Papers

  10. Formation and atomic structure of boron nitride nanotubes with a cup-stacked structure, T. Oku, N. Koi, K. Suganuma, R.V. Belosludov, Y. Kawazoe, Solid State Communications, 143 6-7 331-336, 2007.01, Papers

  11. Thermal stability of poly(vinylidene fluoride) films pre-annealed at various temperatures, M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro, Polymer Degradation and Stability, 92 10 1833-1840, 2007.01, Papers

  12. Influential factor in determining the thermal conductivity of isotropic conductive adhesives, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka and K. Suganuma, Proc. EcoDesign 2006 Asia-Pacific Conference, 2006.12, Conference Report / Oral Presentation

  13. Development of super flexible touch sensors, M. Inoue, K. Suganuma, T. Miyashita, H. Ishiguro, 11, [10], pp. 44-48, 2006.10, Review Papers(In Japanese)

  14. Development of an electrophoretic sol-gel coating process for porous metals, M. Inoue, S.-K. Hyun, K. Suganuma, H. Nakajima, Materials Transactions, 47 [9], 2161-2166, 2006.09, Papers

  15. Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka and K. Suganuma, Proceedings of HDP’06, pp.63-68, 2006.06, Conference Report / Oral Presentation

  16. Development of skin sensors for humanoid robots using wiring technology with conductive adhesives, M.Inoue, H.Sasaki, K.Suganuma, T.Kawasaki, T.Rokuhara, T.Miyashita, H.Ishiguro, pp.247-248, 2006.03, Conference Report / Oral Presentation (In Japanese)

  17. Formation of ceramic coatings on porous metals by electrophoretic sol-gel deposition, M. Inoue, S.-K. Hyun, K. Suganuma, H. Nakajima, Porous Metals and Metal Foaming Technology (Proc. of MetFoam 2005, Japan Inst. Metals), pp.655-658, 2006.02, International Conference(Proceedings)

  18. Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder, M. Inoue and K. Suganuma, Soldering and Surface Mount Technology, vol.18, No.2, pp.40-46, 2006.02, Papers

  19. Analytical equations for predicting thermal properties of isotropic conductive adhesives, M. Inoue, T. Sugimura, M. Yamashita, S. Yamaguchi and K. Suganuma, Journal of Electronic Materials, vol. 34, No.12, pp.1586-1590, 2005.12, Papers

  20. Analytical Equations for Predicting The Thermal Properties of Isotropic Conductive Adhesives, M. Inoue, T. Sugimura, M. Yamashita, S. Yamaguchi and K. Suganuma, Journal of Electronic Materials, 34 , 1586-1590, 2005.12, Papers

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