Academic Papers

101. Prevention of Sn Whisker Formation by Surface Treatment of Sn Plating Part 2, *K.S. Kim, S.S. Kim, S.K. Kim, K. Suganuma, M. Tsujimoto, I. Yanadaa, 2008.03, International Conference(Non Proceeding)

102. Degradation of Ag-Epoxy Conductive Adhesive/Sn Interface in Humid Atmosphere, S.S. Kim, K.S. Kim and K. Suganuma, 2008.03, International Conference(Proceedings)

103. Interfacial Reactions of Die Attached AlN-DBC Module Using Zn-Sn High Temperature Solders, S.J. Kim, K.S. Kim, D.S. Kim and K. Suganuma, 2008.03, International Conference(Proceedings)

104. Novel method for room temperature sintering of Ag nanoparticle paste in air, D. Wakuda, M. Hatamura, K. Suganuma, Chemical Physics Letters, 441 4-6 305-308, 2008.01, Papers

105. The dependence on thermal history of the electrical properties of an epoxy-based isotropic conductive adhesive, M. Inoue, K. Suganuma, J. Electronic Materials, 36 6 669-675, 2008.01, Papers

106. A study on solder electromigration in Cu/In/Cu flip-chip joint system, K. Yamanaka, Y. Tsukada, K. Suganuma, エレクトロニクス実装学会誌, 11 1 60-65, 2008.01, Papers

107. Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy, J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, K. Suganuma, J. Alloys and Compounds, 454 1-2 310-320, 2008.01, Papers

108. Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles, N. Koi, T. Oku, M. Inoue, K. Suganuma, J. Materials Science, 43 8 2955-2961, 2008.01, Papers

109. A super-flexible sensor system for humanoid robots and related applications, M. Inoue, Y. Kawahito, Y. Tada, T. Hondo, T. Kawasaki, K. Suganuma, H. Ishiguro, エレクトロニクス実装学会誌, 11 2 136-140, 2008.01, Papers

110. Microstructure development of mechanical-deformation-induced Sn whiskers, *S. K. Lin, Y. Yorikado, J. Jiang, K.S. Kim, K. Suganuma, S.W. Chen, M. Tsujimoto, I. Yanada, J. Electronic Mater., 36 12 1732-1734, 2007.12, Papers

111. Design and synthesis of mesoporous nano-silver-based die attach material for high power electronics, K. Suganuma, J. Jiu, D.S. Kim, K.S. Kim, 2007.11, International Conference(Proceedings)

112. Impact property evaluation of Ag-epoxy conductive adhesive joint, D.S. Kim, M. Kang, K.S. Kim, S.S. Kim, S.J. Kim, K. Suganuma, 2007.11, International Conference(Proceedings)

113. Zn-Sn and Zn-In high temperature lead-free solders, K. Suganuma, S.J. Kim, J.E. Lee, K.S. Kim,, 2007.11, International Conference(Proceedings)

114. Room Temperature Sintering of Ag Nanoparticle Paste and its Mechanism, D. Wakuda, M. Hatamura and K. Suganuma, 2007.11, International Conference(Proceedings)

115. A Flexible and Stretchable Tactile Sensor Utilizing Static Electricity, Y. Tada, M. Inoue, T. Kawasaki, Y. Kawahito, H. Ishiguro, K. Suganuma, 2007.10, International Conference(Proceedings)

116. Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system, *K. Yamanaka, Y. Tsukada, K. Suganuma, Microelectronics Reliability, 47 8 1280-1287, 2007.08, Papers

117. Thermal stability of poly (vinylidene fluoride) films pre-annealed at various temperatures, Masahiro Inoue, Yasunori Tada, Katsuaki Suganuma and Hiroshi Ishiguro, Polymer Dgradation and Stability, Vol. 92, No. 10, pp. 1833-1840, 2007.07, Papers

118. Properties of low temperature Sn-Ag-Bi-In solder systems, *K.S. Kim, T. Imanishi, K. Suganuma, M. Ueshima, R. Kato, Microelectronics Reliability, 47 7 1113-1119, 2007.07, Papers

119. Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging, *S.K. Lin, Y. Yorikado, J. Jiang, K.S. Kim, K. Suganuma, S.W. Chen, M. Tsujimoto, I. Yanada, J. Materials Research, 22 7 1975-1986, 2007.07, Papers

120. Sn-Ag-Cu soldering reliability influenced by process atmosphere, *A. Baated, J. Jiang, K.S. Kim, K. Suganuma, S. Huang, B. Jurcik, S. Nozawa, M. Ueshima, 2007.06, International Conference(Proceedings)