Academic Papers

Division display  81 - 100 of about 351 ／  All the affair displays >>

  1. Degradation Mechanism of Conductive Adhesive/Sn Interface under High Humidity, *S.S. Kim, K.S. Kim, S.J. Kim, K. Suganuma, 2008.11, International Conference(Proceedings)

  2. Synthesis and nanostructure of boron nitride nanotubes grown from iron-evaporated boron, T.Oku, N. Koi, K. Suganuma, Diamond and Related Materials, 17 1805-1807, 2008.10, Papers

  3. Synthesis of Ag nanorods and application to soft die attaching, *J. Jiu, K. Murai, K.S. Kim and K. Suganuma, 2008.09, International Conference(Proceedings)

  4. Room Temperature Sintering of Ag Nano-scale particles with drying of the solvent, *D. Wakuda, K.S. Kim, K. Suganuma, 2008.09, International Conference(Proceedings)

  5. Room Temperature Sintering Mechanism of Ag Nanoparticle Paste, *D. Wakuda, C.J. Kim, K.S. Kim, K. Suganuma, 2008.09, International Conference(Proceedings)

  6. Degradation Mechanism of Ag-Epoxy Conductive Adhesive Joints by Heat and Humidity Exposure, *S.S. Kim, K.S. Kim, K. Suganuma, H. Tanaka, 2008.09, International Conference(Proceedings)

  7. Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders, *S.J. Kim, K.S. Kim, G. Izuta, K. Suganuma, 2008.09, International Conference(Proceedings)

  8. Room temperature sintering of Ag nanoparticles by drying solvent, D. Wakuda, K.S. Kim, K. Suganuma, Scripta Materialia, 59 649-652, 2008.09, Papers

  9. Oxidation behavior of Sn-Zn solders under high-temperature and high-humidity conditions, J. Jiang, J.E. Lee, K.S. Kim, K. Suganuma, J. Alloys and Compounds, 462 244-251, 2008.08, Papers

  10. Structures and purification of boron nitride nanotubes synthesized from boron-based powders with iron particles, N. Koi, T. Oku, M. Inoue, K. Suganuma, J. Materials Science, 43 2955-2961, 2008.08, Papers

  11. Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu, *A. Baated, K.S. Kim, K. Suganuma, S. Huang, M. Ueshima, B. Jurcik, S. Nozawa, 2008.07, International Conference(Non Proceeding)

  12. Large-scale synthesis of micrometer-scale single-crystal gold nanosheets by polyol process, *J. Jiu, K. Suganuma, K.S. Kim, T. Nemoto, T. Ogawa, S. Isoda, 2008.07, International Conference(Non Proceeding)

  13. Developing the Stencil Printing Process for 01005 Lead-Free Assemblies, *Y.W. Lee, K.S. Kim, K. Suganuma, J.H. Kim, 2008.07, International Conference(Proceedings)

  14. Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application, S.J. Kim, K.S. Kim, S.S. Kim, C.Y. Kang, K. Suganumai, Materials Transactions, 49 1531-1536, 2008.07, Papers

  15. The root causes of the "black pad" phenomenon and avoidance tactics, K. Suganuma, K.S. Kim, JOM, 60 61-65, 2008.06, Papers

  16. Electronic and optical properties of boron nitride nanotubes, T. Oku, N. Koi, K. Suganumai, J. Physics and Chemistry of Solids, 69 1228-1231, 2008.06, Papers

  17. Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound, S. Kumamoto, H. Sakurai, Y. Kukimoto, K. Suganumai, J. Electron. Mater., 37 806-814, 2008.06, Papers

  18. Variations in polymeric structure of ferroelectric poly(vinylidene fluoride) films during annealing at various temperatures, M. Inoue, Y. Tada, K. Suganuma, H. Ishiguro, J. Applied Polymer Science, 111 2837-2843, 2008.06, Papers

  19. Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy, J.E. Lee, K.S. Kim, M. Inoue, J. Jiang, K. Suganuma, J. Alloys and Compounds, 454 310-320, 2008.04, Papers

  20. Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive, M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma, J. Electron. Mater., 37 462-468, 2008.04, Papers

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