Academic Papers

Division display  41 - 60 of about 351 ／  All the affair displays >>

  1. Super Stretchable and Flexible Conductive Elastomer, T. Araki, N. Nogi, K. Suganuma, 2011.01, International Conference(Proceedings)

  2. Low Temperature Wiring Technology for Printed Electronics, K. Suganuma, M. Nogi, M. Hatamura, T. Araki, J. Jiu, 2010.12, International Conference(Non Proceeding)

  3. Effects of crystallographic orientation of Sn on electromigration behavior, K. Lee, K.S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma, 2010.11, International Conference(Proceedings)

  4. Low temperature wiring with silver nano-inks, K.Suganuma, 2010.10, International Conference(Non Proceeding)

  5. High temperature lead-free solders(Plenary), K. Suganuma, 2010.09, International Conference(Non Proceeding)

  6. The effect of microvia-in-pads design on SMT defects in ultra-small component assembly, Y.W. Lee, K.S. Kim, K. Suganuma, 2010.08, International Conference(Proceedings)

  7. Effects of the crystallographic orientation of Sn grain during electromigration test, K. Lee, K. S. Kim, K. Yamanaka, Y. Tsukada, S. Kuritani, M. Ueshima, K. Suganuma, 2010.08, International Conference(Proceedings)

  8. Tin Whisker Mitigation Project of JEITA, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  9. Low Temperature Nano-Ag Wiring on Textiles by Ink-jet print, J. Jiu, K. Suganuma, C. Kim, D. Wakuda, M. Nogi, Y. Linm P. Chen, 2010.06, International Conference(Proceedings)

  10. Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating,, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2010.06, International Conference(Proceedings)

  11. Evaluation of Conformal Coating for Mitigation of Tin Whisker Growth (Part II), T. Nakagawa, T. Yamada, N. Nemoto, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  12. Optically transparent substrates from plants nanofibers for printed electronics, M. Nogi, K.Suganuma, and H. Yano, 2010.06, International Conference(Proceedings)

  13. Tin Whisker Evaluation Status for Space Application, N. Nemoto, T. Nakagawa, T. Yamada, K. Suganuma, 2010.06, International Conference(Non Proceeding)

  14. Prevention technologies of whisker growth for reliable electronic, K.Suganuma, 2010.05, International Conference(Non Proceeding)

  15. Intermetallic growth rate effects on spontaneous whisker growth from Tin coating on copper, A. Baated, K.S. Kim, K. Suganuma, 2010.05, International Conference(Proceedings)

  16. Intermetallic Growth Rate Effects on Spontaneous Whisker Growth from Tin Coating on Copper, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2010.05, International Conference(Proceedings)

  17. Formation mechanism of nanostructured Ag films from Ag2O particles using a sonoprocess, M. Inoue, Y. Hayashi, H. Takizawa, K. Suganuma, Colloid and Polymer Science, 288 1061-1069, 2010.05, Papers

  18. Effects of Zn-containing Flux on the Joint Strength and Microstructure of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish, H. Sakurai, A. Baated, K. Lee, S. Kim, K.S. Kim, K. Suganuma, 2010.02, International Conference(Non Proceeding)

  19. Effect of Zn-Containing Flux on the Joint Strength and Microstructure? of Sn-3.5Ag Soldering on an Electroless Ni-Au Surface Finish, H. Sakurai, Y. Kukimoto, K. Suganuma, 2010.02, International Conference(Proceedings)

  20. Influential factors in determining the adhesive strength of ACF joints, M. Inoue, K. Suganuma, J. Mater. Sci.: Materials in Electronics, 20 1247-1254, 2009.10, Papers

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