Academic Papers

21. Low-temperature Low-pressure Die Attach with Hybrid Silver Particle Paste, K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. -S. Kim, M. Nogi, Microelectron. Reliab, 52 375?380 , 2011.09, Papers

22. Room temperature fabrication of silver nanowire transparent electrodes, T. Tokuno, M. Nogi, M. Karakawa, J. Jiu, Y. Aso, K. Suganuma, 2011.09, International Conference(Proceedings)

23. Printable and Stretchable Conductive Wirings Comprising Silver Flakes and Elastomer, M. Nogi, K. Suganuma, M. Kogure, O. Kirihara, IEEE Electron Device Lett., 32 1424 - 1426 , 2011.08, Papers

24. Preparation of rod-shaped and spherical Silvernanoparticles and application for Packaging materials, Jinting Jiu, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

25. Return Loss of Printed Silver Paste Lines with Different Filler Sizes and Their Surface Roughness, Natsuki Komoda, Katsuaki Suganuma, Masaya Nogi, 2011.08, International Conference(Proceedings)

26. Effect of Ink Viscosity on Electrical Resistivity of Narrow Printed Silver Lines, ChangJae Kim, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

27. Properties of Silver Nanowire Transparent Electrodes Fabricated by a Coating Method, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

28. Preparation and characterization of bacterial cellulose/chitosan porous scaffolds, Thi Thi Nge, Masaya Nogi, Hiroyuki Yano, Junji Sugiyama, 2011.08, International Conference(Proceedings)

29. Preparation of rod-shaped and spherical Silvernanoparticles and application for Packaging materials, Jinting Jiu, Takehiro Tokuno, Masaya Nogi, Katsuaki Suganuma, 2011.08, International Conference(Proceedings)

30. Return Loss of Printed Silver Paste Lines with Different Filler Sizes and Their Surface Roughness, K. Natsuki, K. Suganuma, M. Nogi, 2011.08, International Conference(Proceedings)

31. Effect of Ink Viscosity on Electrical Resistivity of Narrow Printed Silver Lines, C. Kim, M. Nogi, K.Suganuma, 2011.08, International Conference(Proceedings)

32. Properties of Silver Nanowire Transparent Electrodes Fabricated by a Coating Method, T. Takehiro, M. Nogi. , K. Suganuma, 2011.08, International Conference(Proceedings)

33. Low temperature die-attaching with silver particle pastes, K. Suganuma, S. Sakamoto, N. Kagami and M. Nogi, 2011.07, International Conference(Non Proceeding)

34. Low temperature wirings and conductive films with Ag nano inks, M. Nogi, K. Suganuma, 2011.06, International Conference(Non Proceeding)

35. Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint, Kiju Lee*,Keun-Soo,Kim,Yutaka Tsukada,Katsuaki Suganuma,Kimihiro Yamanaka, Soichi Kuritani,Minoru Ueshima, Microelectron. Reliab, 51[12] 2290-2297 , 2011.05, Papers

36. Size Effect on Resistivity of Narrow Printed Tracks, ChangJae Kim, Masaya Nogi, Katsuaki Suganuma, 2011.04, International Conference(Proceedings)

37. Effects of Cu-bearing Flux on Sn-3.5Ag Soldering with Electroless Ni-P/Au Surface Finish: Microstructure and Joint Reliability, H. Sakurai, K-S. Kim, Y. Kukimoto, K. Suganuma, 2011.02, International Conference(Non Proceeding)

38. Electromigration Behavior of Sn-In Lead-Free Solder Alloy Under High Current Stress, K. Lee, K-S. Kim, K. Suganuma, 2011.02, International Conference(Non Proceeding)

39. Whisker Growth Behavior in a High Vacuum with Thermal Cycling, K-S. Kim, J. Jo, K. Lee, A. Baated, K. Suganuma, N. Nemoto, T. Nakagawa, T. Yamada, 2011.02, International Conference(Non Proceeding)

40. Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating,, Alongheng Baated, Keun-Soo Kim, and Katsuaki Suganuma, 2011.01, International Conference(Proceedings)