Academic Papers

Division display  301 - 320 of about 351 ／  All the affair displays >>

  1. Research and Development of Lead-free Soldering and Problems, Katsuaki Suganuma, Vol.~2, 51-57, 1999.01, Review Papers(In Japanese)

  2. High Cost-performance Ceramic/Metal Composites by Casting, Katsuaki Suganuma, Vol.~12, No.~1, pp.~23-31, 1999.01, Review Papers(In Japanese)

  3. Microstructure and Fracture Strength of TiN/Al and Al Alloys Interface, Minoru Ueshima, Takeo Oku, Masahiro Inoue, Kimiaki Tanihata, Masao Takahashi, and Katsuaki Suganuma, Key Eng. Mater., 161-163 (1999) 667-670., 161-163 667-670, 1999.01, Papers

  4. Advances in Lead-free Soldering, Katsuaki Suganuma, Vol.~11, No.~12, pp.~21-30, 1998.12, Review Papers(In Japanese)

  5. Structure of Nanocapsules --- Control of Nanospace ---, Takeo Oku, Katsuaki Suganuma, and Takanori Hirano, Vol.~37, No.~12, p.~1016, 1998.12, Review Papers(In Japanese)

  6. Toughening Mechanism of Ni$_3$Al Alloys by B Doping, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Journal of Materials Science Letters, Vol.~17, pp.~1967-1969, Vol.~17, pp.~1967-1969, 1998.12, Papers

  7. Fracture Properties of Fe-40at\% Al Matrix Composites Reinforced with Ceramic Particles and Fibers, Masahiro Inoue, Hideki Nagao (National Defense Academy), Katsuaki Suganuma, and Koichi Niihara, Materials Science and Engineering A, Vol.~258, pp.~298-305, Vol.~258, pp.~298-305, 1998.11, Papers

  8. Fracture Properties of Fe-40at\% Al Alloys Fabricated by Reactive Hot-pressing, Masahiro Inoue, Katsuaki Suganuma, and Koichi Niihara, Scripta Materialia, Vol.~39, pp.~1477-1482, Vol.~39, pp.~1477-1482, 1998.10, Papers

  9. Fabrication of Ceramic-Metal Composite by Pressure Infiltration of Metal to Porous Ceramics, Kimiaki Tanihata and Katsuaki Suganuma, Key Engineering Materials, Vol.~161-163, pp.~259-262, Vol.~161-163, pp.~259-262, 1998.10, Papers

  10. Research Trends of lead-free Soldering, Katsuaki Suganuma, Vol.~14, No.~9, pp.~54-63, 1998.09, Review Papers(In Japanese)

  11. Effects of Boron Doping on Fracture Properties of Ni$_3$Al Matrix Composites with Ceramic Particles, Masahiro Inoue, Kei Takahashi (National Defense Academy), Katsuaki Suganuma, and Koichi Niihara, Scripta Materialia, Vol.~39, pp.~887-892, Vol.~39, pp.~887-892, 1998.09, Papers

  12. Effects of Boron Doping on Fracture Properties of Ni$_{3}$Al Matrix Composites with Ceramic Particles, Masashi Inoue, Koji Takahashi, Katsuaki Suganuma, and Koichi Niihara, Scr.~Mater., Vol.~39, No.~7, pp.~887-892, Vol.~39, No.~7, pp.~887-892, 1998.09, Papers

  13. Possible Detection of Doping Atoms in B$_{12}$ and C$_{60}$ Solid Clusters, Takeo Oku, Jan-Olov Bovin (Lund University, Sweden), Hiroshi Kubota (Kumamoto University),\- Takeshi Ohgami (Kumamoto University), and Katsuaki Suganuma, Proceedings of International Congress on Electron Microscopy, Vol.~14, pp.~387-388, Vol.~14, pp.~387-388, 1998.08, Conference Report / Oral Presentation

  14. HREM of Carbon Nanocapsules with Nanoparticles, Takeo Oku, Gunter Schmid (Essen University, Germany), Koichi Niihara, and Katsuaki Suganuma, Proceedings of International Congress on Electron Microscopy, Vol.~14, pp.~91-92, Vol.~14, pp.~91-92, 1998.08, Conference Report / Oral Presentation

  15. Formation of Carbon Onions with Pd Clusters in High-resolution Electron Microscope, Takeo Oku, Gunter Schmid (Essen University, Germany), and Katsuaki Suganuma, Journal of Materials Chemistry, Vol.~8, pp.~2113-2117, Vol.~8, pp.~2113-2117, 1998.08, Papers

  16. Formation of Carbon Nanocapsules with SiC Nanoparticles Prepared by Polymer Pyrolysis, Takeo Oku, Koichi Niihara, and Katsuaki Suganuma, Journal of Materials Chemistry, Vol.~8, pp.~1323-1325, Vol.~8, pp.~1323-1325, 1998.05, Papers

  17. Formation and Structure of Nano-Intermaterials, Takeo Oku, Katsuaki Suganuma, and Gunter Schmid (Essen University, Germany), Proceedings of the SANKEN Int.~Symp.~, Vol.~1, pp.~165-166, Vol.~1, pp.~165-166, 1998.04, Conference Report / Oral Presentation

  18. Microstructural Features of Lift-off Phenomenon in Through-hole Circuit Soldered by Sn-Bi Alloy, Katsuaki Suganuma, Scripta Materialia, Vol.~38, pp.~1333-1340, Vol.~38, pp.~1333-1340, 1998.04, Papers

  19. Wetting and Interface Microstructure between Sn-Zn Binary Alloys and Cu, Katsuaki Suganuma, Koichi Niihara, Takeshi Shoutoku~(National Defense Academy), and Yoshikazu Nakamura (National Defense Academy), Journal of Materials Research, Vol.~13, pp.~2859-2865, Vol.~13, pp.~2859-2865, 1998.04, Papers

  20. Guideline for development of aluminide matrix composites with high performance, Masahiro Inoue and Katsuaki Suganuma, Vol. 14, No. 3, pp. 39-45, 1998.03, Review Papers(In Japanese)

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