Academic Papers

Division display  221 - 240 of about 351 ／  All the affair displays >>

  1. Microstructure changes in Sn-Zn/Cu joints during heat-exposure, Keun-Soo Kim, Young-Sun Kim, Katsuaki Suganuma, and Hideo Nakajima, J. Japan Institute of Electronics Packaging, 5-7, 666-671, 2002.11, Papers(In Japanese)

  2. Carburization of TiAl Alloys by Reactive Plasma Process at Elevated Temperatures, Masahiro Inoue, Masanobu Nunogaki, Katsuaki Suganuma, 2002.10, Conference Report / Oral Presentation

  3. Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K.-S. Kim, Y. Takagi, J. Sugimoto and M. Ueshima, IEEE Trans. on Electronics Packaging Manufacturing, 25[4](2002), 257-261., 257-261, 2002.10, Papers

  4. Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, Materials Science and Engineering A, vol. 333 pp.106-114, vol. 333 pp.106-114, 2002.08, Papers

  5. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys, K. S. Kim, S. H. Huh, and K. Suganuma, Materials Science and Engineering A, 333(August), 106-114, 2002.08, Papers

  6. Mechanical behavior of reactively hot-pressed FeAl matrix composites with carbide particles at elevated temperatures, Masahiro Inoue, Katsuaki Suganuma, Journal of Materials Science Letters, 2002.07, Papers

  7. Degradation mechanism of Ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure, M. Yamashita and K. Suganuma, journal of electronic materials pp.551-556, pp.551-556, 2002.06, Papers

  8. Joining reliability of Sn-Ag-Cu series solder alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, International Conference on Electronics Packaging (ICEP), Tokyo.pp.89-92, 2002.04, Conference Report / Oral Presentation

  9. Thermal and mechanical stability of soldering QFP with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto, and M. Ueshima, IEEE Trans. Elec. Pack. Manu., 25-4, 257-261, 2002.04, Papers

  10. Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Materials Transactions, JIM, vol. 43 pp.239-245, vol. 43 pp.239-245, 2002.02, Papers

  11. Effect of Au addition on microstructural and mechanical properties of Sn-Cu eutectic solder, S. H. Huh, K. S. Kim, and K. Suganuma, Materials Transactions, JIM, 43-2, 239-245, 2002.02, Papers

  12. High temperature stability of lead-free soldering interface, K.Suganuma and C.W.Hwang, Proc. Electronics Goes Green 2000+, ed. By H. Reighl and H.Griese, VDE Verlag, (2000), 67-72., 67-72, 2002.01, Conference Report / Oral Presentation

  13. Structural characterization of the metal/glass interface in bioactive glass coatings on Ti-6Al-4V, T. Oku, K. Suganuma, L. R. Wallenberg, A. P. Tomsia, J. M. Gomez-Vega, E. Saiz, J. Mater. Sci. Mater. Med., Vol. 12, pp. 413-417., Vol. 12, pp. 413-417, 2001.12, Papers

  14. Effect of alloying additives on microstructure and mechanical properties of Sn-Ag-Cu solder alloys, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, Proc. 4th Pacific Rim International Conference on Advanced Materials and Processing, Hawaii.pp.1051-1054, 2001.12, Conference Report / Oral Presentation

  15. The Development and Commercialization of Lead-Free Soldering, K.Suganuma, MRS Belletin, 26 880-884, 26 880-884, 2001.11, Papers

  16. Atomic structure and stability of elliptical onion, H. Kitahara, T. Oku and K. Suganuma, European Physical Journal D, Vol. 16, pp. 361-363., Vol. 16, pp. 361-363, 2001.10, Papers

  17. Synthesis, atomic structures and arrangement of carbon and boron nitride nanocage materials, T. Oku, H. Kitahara, M. Kuno, I. Narita and K. Suganuma, Scripta Materialia, Vol. 44, pp. 1557-1560., Vol. 44, pp. 1557-1560, 2001.09, Papers

  18. Synthesis of boron nitride nanotubes and nanocapsules with LaB6, M. Kuno, T. Oku and K. Suganuma, Diamond and Related Materials, Vol. 10, pp. 1231-1234., Vol. 10, pp. 1231-1234, 2001.06, Papers

  19. High-resolution electron microscopy and structural optimization of C36, B36N36 and Fe@B36N36 clusters, Takeo Oku and Katsuaki Suganuma, Diamond and Related Materials, Vol. 10, pp. 1205-1209., Vol. 10, pp. 1205-1209, 2001.06, Papers

  20. Synthesis and characterization of cobalt nanoparticles encapsulated in boron nitride nanocages, H. Kitahara, Takeo Oku, T. Hirano and K. Suganuma, Diamond and Related Materials, Vol. 10, pp. 1210-1213., Vol. 10, pp. 1210-1213, 2001.06, Papers

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