Academic Papers

Division display  201 - 220 of about 351 ／  All the affair displays >>

  1. Thermal and mechanical stability of SMT structures soldered with Sn-Bi-Ag lead-free alloy, K. Suganuma, T. Sakai, K. S. Kim, Y. Takagi, J. Sugimoto and M. Ueshima, 2003.04, Papers

  2. Solderability and Interface Property of Sn-Zn-Bi on Metal Substrates, Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma, 2003.03, Conference Report / Oral Presentation

  3. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, K.-S. Kim, S. -H. Hwuh and K. Suganuma, Microelectronics Reliability, 43(2003), 259-267., 43259-267, 2003.03, Papers

  4. Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating, C. Hwang, J.-G. Lee, K.Suganuma and H. Mori, J. Electron. Mater., 32[2](2003), 52-62., 52-62, 2003.02, Papers

  5. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, K. S. Kim, S. H. Huh, and K. Suganuma, J. Microelectron Reliab., 43-2, 259-267, 2003.02, Papers

  6. Improvement of Properties of Sn-Cu Lead-Free Solder by Third Element Alloying and its Reliability for Through-Hole Circurt Assembry, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Advances in Technology of Materials and Materials Processing Journal (ATM), 2003.01, Papers

  7. A new approach to an artificial joint based on bio-cartilage/porou ricalcium phosphatesystem, Shinsuke Aoki, Shunro Yamaguchi, Atsushi Nakahira and Katsuaki Suganuma, Journal of the European Ceramic Society, 2003.01, Papers

  8. Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints, K.S. Kim, K. Suganuma, T. Shimozaki, C.G. Lee, Materials Science Forum, 2003.01, Papers

  9. Effect of　composition and cooling rate on microstructure and tensile properties of　Sn-Zn-Bi alloys, Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma, J. Alloy. Compd., 2003.01, Papers

  10. Squeeze Casting for Low Cost Fabrication of Advanced Materials and Joints, K. Suganuma, M. Inoue and K. Tanihata, 2003.01, Conference Report / Oral Presentation

  11. Effect of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, K.-S. Kim, S. -H. Hwuh and K. Suganuma, J. Alloys Compounds, 2003.01, Papers

  12. Effect of composition cooling rate on the microstructure and tensile properties of Sn-Zn-Bi solder alloy, Y.-S. Kim, K.-S. Kim, C.-W. Hwang, K. Suganuma, J. Alloys Compounds, 352(1-2) (2003), 237-245, 352(1-2) 237-245, 2003.01, Papers

  13. Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys, Y. S. Kim, K. S. Kim, C. W. Hwang, and K. Suganuma, J. Alloy. Compd., 352(1-2), 237-245, 2003.01, Papers

  14. Improvement of properties of Sn-Cu lead-free solder by third element alloying and its reliability for through-hole circuit assembly, S. H. Huh, K. S. Kim, and K. Suganuma, Advances in Technology of Materials and Materials Processing Journal (ATM), 5-1, 1-6, 2003.01, Papers

  15. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, K. S. Kim, S. H. Huh, and K. Suganuma, J. Alloy. Compd., 352(1-2), 226-236., 2003.01, Papers

  16. Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints, K. S. Kim, K. Suganuma, T. Shimozaki, and C.G. Lee, Materials Science Forum, 439, 7-11, 2003.01, Papers

  17. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu, Keun-Soo Kim, Seok-Hwan Huh and Katsuaki Suganuma, J. Elservier Science, Microelectron Reliab, 2002.12, Papers

  18. Thermal fatigue damage of lead-free soldered through-hole circuit, Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma, Proc. 4th Pacific Rim International Conference on Advanced Materials and Processing, Hawaii.pp.1071-1074, 2002.12, Conference Report / Oral Presentation

  19. Microstructure changes in Sn-Zn/Cu joints during heat-exposure, Keun-Soo Kim, Young-Sun Kim, Katsuaki Suganuma, and Hideo Nakajima, vol. 5 pp.666-671, 2002.11, Papers(In Japanese)

  20. Alloying Design for Lead-Free Soldering, K. Suganuma, Keun-Soo Kim and Chi-Won Hwang, International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka, Japan.pp.25-28, 2002.11, Conference Report / Oral Presentation

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