Academic Papers

Division display  181 - 200 of about 351 ／  All the affair displays >>

  1. The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging, K. S. Kim, K. Suganuma, J. M. Kim, and C. W. Hwang, JOM, 56-6, 2004.06, Papers

  2. Physicochemical phenomena induced by water sorption in flexible printed circuit/glass substrate joints using anisotropic conductive films, M. Inoue, T. Miyamoto and K. Suganuma, 2004.06, Conference Report / Oral Presentation

  3. Influence of lead contamination on reliability of lead free soldered joints, K. Suganuma and K. -S. Kim, 2004.06, Conference Report / Oral Presentation

  4. Effects of composition on microstrcuture and on thermal stability of Sn-Ag-In lead-free soldered joints, K.S. Kim, T. Imanishi, K.Suganuma, S.Kumamoto and M.Aihara, Trans.Mater.Res.Soc.Jpn, 29[5], 2004.05, Papers

  5. Effect of moisture absorption on the reliability of ACF interconnects between FPC and glass substrates, M.Inoue, T.Miyamoto, K.Suganuma, Proc. ICEP 2004, 2004.04, International Conference(Non Proceeding)

  6. Effect of moisture absorbtion on ACF interconnects, M. Inoue, T. Miyamoto, K.Suganuma, 2004.04, Conference Report / Oral Presentation

  7. Analysis of thermal properties of isotropic conductive adhesives by composite theories, T.Sugimura, M.Inoue, M.Yamashita, S.Yamaguchi, K.Suganuma, Journal of Japan Institute of Electronic Packaging, 2004.03, Papers(In Japanese)

  8. Differences in Formation and Growth of Interface Between Sn-Ag and Sn-Ag-Cu Lead-Free Solder with Ni-P/Au Plating, C.-W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, 2004.03, Conference Report / Oral Presentation

  9. Development of New Lead-Free Solder Containing Nano Sized Particles, K.-S. Kim, K. Suganuma,M. Ueshima, 2004.03, Conference Report / Oral Presentation

  10. Solidification phenomenon in CSP soldering with Sn-Ag-Cu lead-free alloy using in situ observation system with computer simulation, K.-S. Kim, J.-M. Kim, K.Suganuma,C.-W. Hwang, 2004.03, Conference Report / Oral Presentation

  11. Effect of Cu addition to Sn-Ag lead-free solder on interfacial stability with Fe-42Ni, C. -W. Hwang and K. Suganuma, Mater. Trans., 45[3] (2004) 714-720, 2004.03, Papers

  12. In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu lead-free alloy, K.-S. Kim, S. -H. Hwuh and K. Suganuma, Microelectronics Reliability, 2003.12, Papers

  13. In-situ observation and simulation on the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy, K. S. Kim, M. Haga, and K. Suganuma, J. Electron. Mater., 32-12. 1483-1489, 2003.12, Papers

  14. Spreading of Sn-Ag solders on Fe-Ni alloys, E. Saiz, C.-W. Hwang, K. Suganuma and A. P. Tomsia, 2003.11, Papers

  15. Interfaces in lead-free soldering, C.-W. Hwang, K.-S. Kim and K. Suganuma, J. Electron. Mater, 2003.11, Papers

  16. Interfaces in lead-free soldering, C. W. Hwang, K. S. Kim, and K. Suganuma, J. Electron. Mater., 32-11, 1249-1256, 2003.11, Papers

  17. Effect of the joining pressure on Ag-epoxy conductive adhesive/Sn interfaces exposed to heat, M. Yamashita and K. Suganuma, 2003.10, Papers

  18. Influence of Ag addition to Sn-Bi eutectic alloy on microstructure and on mechanical properties, K. Suganuma, T. Sakai and K. S. Kim, J. Japan Institute of Electronics Packaging, 6-5, 414-419, 2003.09, Papers(In Japanese)

  19. Wetting and Strength Issues at Al/α-Alumina Interfaces, E. Saiz, A. P. Tomsia, and K. Suganuma, 2003.07, Papers

  20. Interface Microstructure between Fe-42Ni Alloy and Pure Sn, C.W. Hwang, K. Suganuma, J.-G. Lee and H. Mori, J. Mater. Res, 2003.05, Papers

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