School personnel information

写真b

SUGANUMA Katsuaki


Keyword

Electronics packaging, inorganic materials, composites, metals

Mail Address

Mail Address

URL

http://www.eco.sanken.osaka-u.ac.jp/

Gender

Male

Organization 【 display / non-display

  • 1996.04.01 - , The Institute of Scientific and Industrial Research, Professor

Education 【 display / non-display

Tohoku University Faculty of Engineering  Graduated 1977.03
Tohoku University Graduate School, Division of Engineering  Completed 1982.03

Research topics 【 display / non-display

  • Metallic material properties-related, Inorganic compounds and inorganic materials chemistry-related, Metals production and resources production-related, Material processing and microstructure control-related, Structural materials and functional materials-related, Composite materials and interfaces-related, Inorganic materials and properties-related, Electric and electronic materials-related

Academic Society Membership 【 display / non-display

  • TMS

 

Academic Papers 【 display / non-display

  • Highly conductive wiring and reliable bonding for stretchable electronics, Cai-Fu Li, Hao Zhang; Wanli Li; Tohru Sugahara; ZhiQuan Liu; Katsuaki Suganuma,The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma,The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma,The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste, D. J. Kim, C. T. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara,and K. Suganuma,58 SBBD15, 2019.03, Papers

  • Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste, D. J. Kim, C. T. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara,and K. Suganuma,58 SBBD15, 2019.03, Papers

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Books 【 display / non-display

  • Special, Forefront of Printed Circuit Board, K. Suganuma, Kougyou-Chousakai, 2005.01

  • Special, Research and Development in Japan:Handbook of Lead-Free Solder Technology of Microsoldering Assembly, C.A.Handwerker, F.G.gayle, E.E.deKluizeneraar, and K. Suganuma, Marcel Dekker, 2004.01

  • Special, Lead-Free Soldering in Electronics, K.Suganuma(Editor), Marcel Dekker, Inc., 2003.12

Awards 【 display / non-display

  • Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics IMAPS2000, IMAPS, 2001.10

  • The Richard M. Fularth Pacific Award, 1995.11

  • Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004), Masahiro Inoue, Tokuji Miyamoto, Katsuaki Suganuma, JIEP, iMaps-Japan, IEEE CPMT, 2005.04

  • Young Award, KIM Keunsoo, IEEE CPMT Japan, 2003.04

  • The Metallographic Contest: Silver Prize, KIM Keunsoo, The Korean Institute of Metals and Materials, 2003.04

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