School personnel information




Electronics packaging, inorganic materials, composites, metals

Mail Address

Mail Address




Organization 【 display / non-display

  • 1996.04.01 - 2020.03.31, The Institute of Scientific and Industrial Research, Professor

  • 2020.04.01 - , The Institute of Scientific and Industrial Research, Specially Appointed Professor

Education 【 display / non-display

Tohoku University Faculty of Engineering  Graduated 1977.03
Tohoku University Graduate School, Division of Engineering  Completed 1982.03

Research topics 【 display / non-display

  • Metallic material properties-related, Inorganic compounds and inorganic materials chemistry-related, Metals production and resources production-related, Material processing and microstructure control-related, Structural materials and functional materials-related, Composite materials and interfaces-related, Inorganic materials and properties-related, Electric and electronic materials-related

Academic Society Membership 【 display / non-display

  • TMS


Academic Papers 【 display / non-display

  • Well-controlled decomposition of copper complex inks enabled by metal nanowire networks for highly compact, conductive, and flexible copper films, B. Zhang, C. Chen, W. Li, J. Yeom, K. Suganuma, Adv. Mater. Interfaces,7 1901550, 2020.07, Papers

  • Non-Contact Laser Printing of Ag Nanowire-Based Electrode with Photodegradable Polymers, Teppei Araki, Jaap M J den Toonder, Katsuaki Suganuma, Takafumi Uemura, Yuki Noda, Shusuke Yoshimoto, Shintaro Izumi, and Tsuyoshi Sekitani, Journal of Photopolymer Science and Technology , 2019.07, Papers

  • Optimization of the depth resolution for profiling SiO2/SiC interfaces by dual-beam TOF-SIMS combined with etching, Sameshima Junichiro, Takenaka Aya, Muraji Yuichi, Ogawa Shingo, Yoshikawa Masanobu, Suganuma Katsuaki, SURFACE AND INTERFACE ANALYSIS,51(7) 743-753, 2019.07, Other

  • Non-contact Laser Printing of Ag Nanowire-based Electrode with Photodegradable Polymers, Araki, Teppei, den Toonder, Jaap M. J., Suganuma, Katsuaki, Uemura, Takafumi, Noda, Yuki, Yoshimoto, Shusuke, Izumi, Shintaro, Sekitani, Tsuyoshi, JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY,32(3) 429-434, 2019.04, Papers

  • Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics, Zhang Bowen, Li Wanli, Yang Yang, Chen Chuantong, Li Cai-Fu, Suganuma Katsuaki, JOURNAL OF MATERIALS SCIENCE,54(8) 6381-6392, 2019.04, Other

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Books 【 display / non-display

  • Special, Forefront of Printed Circuit Board, K. Suganuma, Kougyou-Chousakai, 2005.01

  • Special, Research and Development in Japan:Handbook of Lead-Free Solder Technology of Microsoldering Assembly, C.A.Handwerker, F.G.gayle, E.E.deKluizeneraar, and K. Suganuma, Marcel Dekker, 2004.01

  • Special, Lead-Free Soldering in Electronics, K.Suganuma(Editor), Marcel Dekker, Inc., 2003.12

Awards 【 display / non-display

  • Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics IMAPS2000, IMAPS, 2001.10

  • The Richard M. Fularth Pacific Award, 1995.11

  • Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004), Masahiro Inoue, Tokuji Miyamoto, Katsuaki Suganuma, JIEP, iMaps-Japan, IEEE CPMT, 2005.04

  • The Metallographic Contest: Silver Prize, KIM Keunsoo, The Korean Institute of Metals and Materials, 2003.04

  • Young Award, KIM Keunsoo, IEEE CPMT Japan, 2003.04

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