School personnel information

写真b

SUGANUMA Katsuaki


Keyword

Electronics packaging, inorganic materials, composites, metals

Mail Address

 Mail Address

URL

http://www.eco.sanken.osaka-u.ac.jp/

Gender

Male
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Organization 【 display / non-display 】

  • 1996.04.01 - 2020.03.31, The Institute of Scientific and Industrial Research, Professor

  • 2020.04.01 - , The Institute of Scientific and Industrial Research, Specially Appointed Professor

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Education 【 display / non-display 】

Tohoku University Faculty of Engineering  Graduated 1977.03
Tohoku University Graduate School, Division of Engineering  Completed 1982.03
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Research topics 【 display / non-display 】

  • Metallic material properties-related, Inorganic compounds and inorganic materials chemistry-related, Metals production and resources production-related, Material processing and microstructure control-related, Structural materials and functional materials-related, Composite materials and interfaces-related, Inorganic materials and properties-related, Electric and electronic materials-related

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Academic Society Membership 【 display / non-display 】

  • TMS

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Academic Papers 【 display / non-display 】

  • Non-Contact Laser Printing of Ag Nanowire-Based Electrode with Photodegradable Polymers, Teppei Araki, Jaap M J den Toonder, Katsuaki Suganuma, Takafumi Uemura, Yuki Noda, Shusuke Yoshimoto, Shintaro Izumi, and Tsuyoshi Sekitani, Journal of Photopolymer Science and Technology , 2019.07, Papers

  • Non-contact Laser Printing of Ag Nanowire-based Electrode with Photodegradable Polymers, Teppei Araki, Jaap M J den Toonder, Katsuaki Suganuma, Takafumi. Uemura, Yuki Noda, Shusuke Yoshimoto, Shintaro Izumi, Tsuyoshi Sekitani, Nanotechnology, 2019.06, Papers

  • Highly conductive wiring and reliable bonding for stretchable electronics, Cai-Fu Li, Hao Zhang; Wanli Li; Tohru Sugahara; ZhiQuan Liu; Katsuaki Suganuma，The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma，The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma，The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

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Books 【 display / non-display 】

  • Special, Forefront of Printed Circuit Board, K. Suganuma, Kougyou-Chousakai, 2005.01

  • Special, Research and Development in Japan:Handbook of Lead-Free Solder Technology of Microsoldering Assembly, C.A.Handwerker, F.G.gayle, E.E.deKluizeneraar, and K. Suganuma, Marcel Dekker, 2004.01

  • Special, Lead-Free Soldering in Electronics, K.Suganuma(Editor), Marcel Dekker, Inc., 2003.12

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Awards 【 display / non-display 】

  • Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics IMAPS2000, IMAPS, 2001.10

  • The Richard M. Fularth Pacific Award, 1995.11

  • Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004), Masahiro Inoue, Tokuji Miyamoto, Katsuaki Suganuma, JIEP, iMaps-Japan, IEEE CPMT, 2005.04

  • Young Award, KIM Keunsoo, IEEE CPMT Japan, 2003.04

  • The Metallographic Contest: Silver Prize, KIM Keunsoo, The Korean Institute of Metals and Materials, 2003.04

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