Details of a Researcher

写真b

SUGANUMA Katsuaki

Keyword	Electronics packaging, inorganic materials, composites, metals
Mail Address
URL	http://www.eco.sanken.osaka-u.ac.jp/
Gender	Male

1996.04.01 - 2020.03.31, The Institute of Scientific and Industrial Research, Professor
2020.04.01 - , The Institute of Scientific and Industrial Research, Specially Appointed Professor

Tohoku University Faculty of Engineering Graduated		1977.03
Tohoku University Graduate School, Division of Engineering Completed		1982.03

Metallic material properties-related, Inorganic compounds and inorganic materials chemistry-related, Metals production and resources production-related, Material processing and microstructure control-related, Structural materials and functional materials-related, Composite materials and interfaces-related, Inorganic materials and properties-related, Electric and electronic materials-related

Well-controlled decomposition of copper complex inks enabled by metal nanowire networks for highly compact, conductive, and flexible copper films, B. Zhang, C. Chen, W. Li, J. Yeom, K. Suganuma, Adv. Mater. Interfaces，7 1901550, 2020.07, Papers
Non-Contact Laser Printing of Ag Nanowire-Based Electrode with Photodegradable Polymers, Teppei Araki, Jaap M J den Toonder, Katsuaki Suganuma, Takafumi Uemura, Yuki Noda, Shusuke Yoshimoto, Shintaro Izumi, and Tsuyoshi Sekitani, Journal of Photopolymer Science and Technology , 2019.07, Papers
Optimization of the depth resolution for profiling SiO2/SiC interfaces by dual-beam TOF-SIMS combined with etching, Sameshima Junichiro, Takenaka Aya, Muraji Yuichi, Ogawa Shingo, Yoshikawa Masanobu, Suganuma Katsuaki, SURFACE AND INTERFACE ANALYSIS，51(7) 743-753, 2019.07, Other
Non-contact Laser Printing of Ag Nanowire-based Electrode with Photodegradable Polymers, Araki, Teppei, den Toonder, Jaap M. J., Suganuma, Katsuaki, Uemura, Takafumi, Noda, Yuki, Yoshimoto, Shusuke, Izumi, Shintaro, Sekitani, Tsuyoshi, JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY，32(3) 429-434, 2019.04, Papers
Fully embedded CuNWs/PDMS conductor with high oxidation resistance and high conductivity for stretchable electronics, Zhang Bowen, Li Wanli, Yang Yang, Chen Chuantong, Li Cai-Fu, Suganuma Katsuaki, JOURNAL OF MATERIALS SCIENCE，54(8) 6381-6392, 2019.04, Other

Special, Forefront of Printed Circuit Board, K. Suganuma, Kougyou-Chousakai, 2005.01
Special, Research and Development in Japan:Handbook of Lead-Free Solder Technology of Microsoldering Assembly, C.A.Handwerker, F.G.gayle, E.E.deKluizeneraar, and K. Suganuma, Marcel Dekker, 2004.01
Special, Lead-Free Soldering in Electronics, K.Suganuma(Editor), Marcel Dekker, Inc., 2003.12

Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics IMAPS2000, IMAPS, 2001.10
The Richard M. Fularth Pacific Award, 1995.11
Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004), Masahiro Inoue, Tokuji Miyamoto, Katsuaki Suganuma, JIEP, iMaps-Japan, IEEE CPMT, 2005.04
Young Award, KIM Keunsoo, IEEE CPMT Japan, 2003.04
The Metallographic Contest: Silver Prize, KIM Keunsoo, The Korean Institute of Metals and Materials, 2003.04