School personnel information

写真b

SUGANUMA Katsuaki


Keyword

Electronics packaging, inorganic materials, composites, metals

Mail Address

 Mail Address

URL

http://www.eco.sanken.osaka-u.ac.jp/

Gender

Male
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Organization 【 display / non-display 】

  • 1996.04.01 - , Institute of Scientific and Industrial Research, Professor, full time

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Education 【 display / non-display 】

Tohoku University Faculty of Engineering  Graduated 1977.03
Tohoku University Graduate School, Division of Engineering  Completed 1982.03
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Research topics 【 display / non-display 】

  • Physical properties of metals, Inorganic industrial materials, Metal making engineering, Material processing/ treatments, Structural/ Functional materials, Composite materials/ Physical properties, Inorganic materials/ Physical properties, Electronic materials/ Electric materials

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Academic Society Membership 【 display / non-display 】

  • TMS

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Academic Papers 【 display / non-display 】

  • Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating, Yukiko Mizuguchi, Yosuke Murakami, Shigetaka Tomiya, Tadashi Asai, Tomoya Kiga and Katsuaki Suganuma, Journal of Electronic Materials, 2012.09, Papers

  • Inkjet-printed lines with well-defined morphologies and low electrical resistance on repellent pore-structured polyimide films, Changjae Kim, Masaya Nogi, Katsuaki Suganuma, Yo Yamato, ACS Applied Materials & Interfaces, 2012.03, Papers

  • Printed Silver Nanowire Antennas with Low Signal Loss at High-Frequency Radio, Natsuki Komoda, Masaya Nogi, Katsuaki Suganuma, Kazuo Kohno, Yutaka Akiyama, Kanji Otsuka, Nanoscale, 2012.03, Papers

  • Effect of Crystal Orientation on Mechanically Induced Sn Whiskers of Sn-Cu Platings, Y. Mizuguchi, Y. Murakami, S. Tomiya, T. Asai, T. Kiga, K. Suganuma, 2012.03, International Conference(Non Proceeding)

  • Heat-resistant die-attach technology for SiC, K. Suganuma, 2012.03, International Conference(Non Proceeding)

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Books 【 display / non-display 】

  • Special, Forefront of Printed Circuit Board, K. Suganuma, Kougyou-Chousakai, 2005.01

  • Special, Research and Development in Japan:Handbook of Lead-Free Solder Technology of Microsoldering Assembly, C.A.Handwerker, F.G.gayle, E.E.deKluizeneraar, and K. Suganuma, Marcel Dekker, 2004.01

  • Special, Lead-Free Soldering in Electronics, K.Suganuma(Editor), Marcel Dekker, Inc., 2003.12

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Patents / Utility models / Designs 【 display / non-display 】

  • Japan, Rubber materials and their fabrication method, K.Suganuma, M.Inoue, H.Ishiguro, T.Kawasaki, T.Rokuhara, T.Miyashita, 2005-342021(Registration), 2005.11

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Awards 【 display / non-display 】

  • Best Paper of Symposium/Best Paper of Session in the 33rd International Symposium on Microelectronics IMAPS2000, IMAPS, 2001.10

  • The Richard M. Fularth Pacific Award, 1995.11

  • Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004), Masahiro Inoue, Tokuji Miyamoto, Katsuaki Suganuma, JIEP, iMaps-Japan, IEEE CPMT, 2005.04

  • The Metallographic Contest: Silver Prize, KIM Keunsoo, The Korean Institute of Metals and Materials, 2003.04

  • Young Award, KIM Keunsoo, IEEE CPMT Japan, 2003.04

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