School personnel information

写真b

UENISHI Keisuke


Keyword

Materials Processing,Management of Technology

Mail Address

Mail Address

Laboratory Phone number

+81-6-6870-4078

Laboratory Fax number

+81-6-6879-4598

URL

http://www.mit.eng.osaka-u.ac.jp/td2/

Gender

Male

Organization 【 display / non-display

  • 1998.04.01 - 2002.03.31, Graduate School of Engineering, Research Assistant

  • 2002.04.01 - 2004.03.31, Graduate School of Engineering, Associate Professor

  • 2004.04.01 - 2007.03.31, Department of Management of Industry and Technology, Graduate School of Engineering, Associate Professor

  • 2007.04.01 - 2008.03.31, Department of Management of Industry and Technology, Graduate School of Engineering, Associate Professor

  • 2008.04.01 - , Department of Management of Industry and Technology, Graduate School of Engineering, Professor

  • 2008.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Professor

  • 2008.04.01 - , Business and Management, Graduate School of Economics, Professor

  • 2013.04.01 - 2015.03.31, Osaka University

  • 2015.04.01 - , Osaka University

  • 2016.10.01 - , Center for Open Innovation Research and Education, Graduate School of Engineering

Education 【 display / non-display

Kyoto University Faculty of Engineering  Graduated 1986.03
Kyoto University Graduate School, Division of Engineering  Completed 1988.03
Kyoto University Graduate School, Division of Engineering  Unfinished 1990.03
Kyoto University Graduate School, Division of Engineering  1992.09

Employment Record 【 display / non-display

Department of Management and Industry, Graduate School of Engineering, Osaka University, Associate Professor 2004.04 - 2007.03
Department of Management of Industry and Technology, Osaka University, Associate Professor 2007.04 - 2008.03
Department of Management of Industry and Technology, Graduate School of Engineering, Osaka University, Professor 2008.04 -

Research topics 【 display / non-display

  • other, Social systems engineering-related, Business administration-related

  • Product and business strategies for servitization of products
    Business administration-related

  • Product Strategies and Third Party Management for Platform Business
    other

  • Development of Micro Joining Materials for Electronics Packaging and Assessment of Their Reliability

    Nano/micro-systems-related, Electron device and electronic equipment-related, Electric and electronic materials-related, Material processing and microstructure control-related

  • Synthesis of Non-Equilibrium Materials by Mechanical Alloying

    Nanomaterials-related, Material processing and microstructure control-related, Composite materials and interfaces-related, Inorganic materials and properties-related

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Academic Society Membership 【 display / non-display

  • Japan Institute of Electronics Packaging

  • Japanese Society for Engineering Education

  • Japan Association for Management Systems

  • The Society of Project Management

 

Academic Papers 【 display / non-display

  • Verification of Smiling Curve of Food Industry in Japan, H.Imahashi, K.Uenishi and K.Gemba, Forum Scientiae Oeconomia,Vol.6, No.4, pp., 2018.12, Papers

  • Expected effects and actual situation of "Health and Productivity Management" in Japan, T.Arai, K.Uenishi and K.Gemba,第61回日本経営システム学会全国研究発表大会,pp.252-253, 2018.10, Conference Report / Oral Presentation (In Japanese)

  • Measurement of Students' Mental-state in Class through Objective Biometrics and Subjective Questionnaire, Y.Tanaka and K.Uenishi, Technical Report of IEICE.,Vol.118, No.261, ET2018-50, pp. 71-76, 2018.10, Conference Report / Oral Presentation (In Japanese)

  • Brand management of small and medium-sized enterprises in Japan, Hiroshi IMAHASHI, Keisuke UENISHI, Kiminori GEMBA, International Journal of Japan Association for Management Systems,Vo.9, Iss.1, p.79-84, 2017.12, Papers

  • Product Decelopment and Intellectual Property Strategy to Secure Market Creation and Competitive Advantage, H.Kojima and K.Uenishi,第59回日本経営システム学会全国研究発表大会,Vol.59, p.88-89, 2017.10, Conference Report / Oral Presentation (In Japanese)

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Books 【 display / non-display

  • Special, Microjoining and nanojoining, Keisuke UENISHI, Woodhead Publishing Limited, 2008.03

Patents / Utility models / Designs 【 display / non-display

  • Japan, Electronics devices and products, Seiki Sakuyama, Toshiya Akamatsum Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai, 特許公開2013-135014(Publication), 2011.12

  • Japan, Solder, Soldering Method and Semiconductor Device, Seiki Sakuyamam Toshiya Akamatsu, Keisuke Uenishi, Hitoshi Kaneko, Hisanori Torii,, 特許第5169871(Registration), 2009.01, 2013.01

Awards 【 display / non-display

  • MES2011 Best Paper Award, K.Okamoto, N.Imaizumi, T.Akamatsu, S.Sakuyama and K.Uenishi, Japan Institute of Electronics Packaging, 2012.09

  • Best Paper Award for Japan Institute of Electronics Packaging , Yasumitsu Orii, Daisuke Toyoshima and Keisuke Uenishi, Japan Institute of Electronics Packaging, 2012.05

  • Outstanding Paper Award, The 6th IMPACT and International 3D IC Joint Conference, Y.Orii, K.Toriyama, S.Kohara, H.Noma, K.Okamoto, D.Toyoshima and K.Uenishi, IEEE, 2011.10

  • Best Research Award for Micro Joining, Seiki Sakuyama, Toshiya Akamatsu, Nobuhiro Imaizumi and Keisuke Uenishi, Japan Welding Society, 2011.05

  • Best Paper Award of Micro Electronics Symposium 2006, Akihiro Oyama, Rieko Tanaka, Suguru Warashina, Keisuke Uenishi and Takehiko Sato, Japan Institute of Electronics Packaging, 2007.09

 

Lecture / Exhibition 【 display / non-display

  • PMI Japan Forum 2016, Necessity of PM Education in various environment and its implementation, 2016.07

  • PMI Japan Forum 2013, 2013.08

Outside Activity Management 【 display / non-display

  • Academic society, Japan Institute of Electronics Packaging, 2012.05 - 2015.03