School personnel information

写真b

MATSUSHIMA Michiya


Keyword

System integration in Electronics,Micro system, Packaging reliability, Visual inspection

URL

http://www.mapse.eng.osaka-u.ac.jp/w5/

Gender

Male

Organization 【 display / non-display

  • 2005.04.01 - 2007.03.31, Division of Materials and Manufacturing Science, Graduate School of Engineering, Research Assistant

  • 2007.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Assistant Professor

Education 【 display / non-display

Osaka University Faculty of Engineering Science Mechanical Engineering Graduated Bachelor's Degree of Engineering 2000.03
Osaka University Graduate School, Division of Engineering Science  Completed Master's Degree of Engineering 2002.03
Osaka University Graduate School, Division of Engineering Science  Completed Ph.D(Engineering) 2005.03

Employment Record 【 display / non-display

Osaka University, Assistant Professor 2005.04 - 2007.03

Research topics 【 display / non-display

  • Resin assembly in electronic devices
    Mechanics of materials and materials-related, Electron device and electronic equipment-related, Electric and electronic materials-related

  • Reliability of Solder Joint Combined Environment of Thermal and Vibration Stress
    Electron device and electronic equipment-related

  • Construction of Neuro Visual Inspection System

    Electron device and electronic equipment-related, Perceptual information processing-related

Academic Society Membership 【 display / non-display

  • Japan Welding Society

  • Japan Institute of Electronics Packaging

 

Academic Papers 【 display / non-display

  • Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices, Michiya Matsushima, Noriyasu Nakashima , Satoshi Nishioka, Shinji Fukumoto and Kozo Fujimoto, Materials Science Forum,Vol. 879, pp 1258-1264, 2017.01, Papers

  • Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin, Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto and Kozo Fujimoto, Materials Transactions,Vol. 57, No. 6, pp. 881 to 886, 2016.05, Papers

  • Effects of Microstructural Changes of the Solder Joint Under Thermal Loading on the Life Under Vibrational Loading, Michiya MATSUSHIMA, Keiichiro MATSUO, Shinji FUKUMOTO, Kozo FUJIMOTO, スマートプロセス学会誌,3(4) 225-231, 2014.07, Papers

  • Effects of material property and structural design on the stress reduction of the joints in electronics devices, Michiya Matsushima, Noriyasu Nakashima, Takashi Fujimoto, Shinji Fukumoto, Kozo Fujimoto, Materials Science Forum,Vols.783-786, pp 2765-2770, 2014.05, Papers

  • Neural network visual inspection with boundary learning based on the distance index in input space, Michiya Matsushima, Akira Soeda, Hiroyuki Fujie, Shinji Fukumoto, Kozo Fujimoto, Proceedings of IEEE International Symposium on Industrial Electronics 2010,pp.1742-1747, 2010.07, International Conference(Proceedings)

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Books 【 display / non-display

  • Special, Practical Programming by Fortran90/95, Kiyokazu Yasuda, et al, Osaka University Press, ISBN, 978-4-87529-473-7 C3004, 2014.03

  • Special, Microjoining and Assembly Technology for Electronics, Kozo Fujimoto et. al., In Tech Information S.C.Co., Ltd, ISBN, 978-4-915957-88-8 C3053, 2012.07

Awards 【 display / non-display

  • MES2007 Best Paper Aword, Kousi Ohta, Masao Toya, Shinichi Motoshige, Kiyokazu Yasuda, Michiya Matsushima, Kozo Fujimoto, Institute of Electronics Packaging, 2008.09

  • IEEE IEMT2006 Best Paper Awards, Kiyokazu Yasuda, Katsumi Taniguchi, Tomoaki Goto, Michiya Matsushima, Kozo Fujimoto, IEEE(Institute of Electrical and Electronics Engineers),CPMT, 2006.11