School personnel information

写真b

Kashiba Yoshihiro


Keyword

micro joining,electronics packaging,manufacturing design

Mail Address

Mail Address

Laboratory Phone number

+81-6-6879-4083

Laboratory Fax number

+81-6-6879-4083

Gender

Male

Organization 【 display / non-display

  • 2017.04.01 - , Graduate School of Engineering, Specially Appointed Professor

 

Academic Papers 【 display / non-display

  • Highly Reliable Solderless Contact with Press-fit Technology for Power Modules, (1) Minoru Egusa, Hidetoshi Ishibashi, Yoshitaka Otsubo, Masao Kikuchi, Yoshihiro Kashiba, 51st International Symposium on Microelectronics, 2018.10, International Conference(Proceedings)

  • Bonding through novel solder-metallic mesh composite design, (1) Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba and Akio Hirose, Materials and Design,160(2018),475-485, 2018.09, Papers

  • Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-temperature Power Modules, Hiroaki Tatsumi et al., 2018 IEEE 68th Electronic Components and Technology Conference, 2018.05, International Conference(Proceedings)

  • Novel solder-mesh interconnection design for power module applications, Adrian Lis et al., International Conference and Exhibition on High Temperature Electronics, 2018.05, International Conference(Proceedings)

  • Press-fit Technology for Power Modules, Minoru Egusa et al.,24th Symposium on"Microjoining and Assembly Technology in Electronics", 2018.01, Conference Report / Oral Presentation (In Japanese)

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