School personnel information

写真b

MATSUDA Tomoki


Mail Address

Mail Address

URL

http://www.mapse.eng.osaka-u.ac.jp/w2/

Gender

Male

Organization 【 display / non-display

  • 2015.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Assistant Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 2011.03
Osaka University Graduate School, Division of Engineering  Completed 2013.03
Osaka University Graduate School, Division of Engineering  Completed 2015.03
 

Academic Papers 【 display / non-display

  • Bonding through novel solder-metallic mesh composite design, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Materials & Design,Vol.160, pp.475-485, 2018.12, Papers

  • AlN-to-metal direct bonding process utilizing sintering of Ag nanoparticles derived from the reduction of Ag2O, Keita Motoyama, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Journal of Electronic Materials,Vol.47, pp.5780-5787, 2018.10, Papers

  • Relationship between intermetallic compound layer thickness with deviation and interfacial strength for dissimilar joints of aluminum alloy and stainless steel, Ryoichi Hatano, Tomo Ogura, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Materials Science and Engineering: A,Vol.735, pp.361-366, 2018.09, Papers

  • Silver oxide decomposition mediated direct bonding of silicon-based materials, Tomoki Matsuda, Kota Inami, Keita Motoyama, Tomokazu Sano, Akio Hirose, Scientific Reports,Vol.8, No.10472, pp.1-8, 2018.07, Papers

  • Hardening and softening effects in aluminium alloys during high-frequency linear friction welding, Adrian Lis, Hideo Mogami, Tomoki Matsuda, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Akio Hirose, Journal of Materials Processing Technology,Vol.255, pp.547-558, 2018.05, Papers

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Awards 【 display / non-display

  • Mate 2017 Excellent Paper Award, 2017.02

  • Excellent Poster Award for Young Scientist, Tomoki Matsuda, 9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9), 2016.08