School personnel information

写真b

MATSUDA Tomoki


Mail Address

Mail Address

URL

http://www.mapse.eng.osaka-u.ac.jp/w2/

Gender

Male

Organization 【 display / non-display

  • 2015.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Assistant Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 2011.03
Osaka University Graduate School, Division of Engineering  Completed 2013.03
Osaka University Graduate School, Division of Engineering  Completed 2015.03
 

Academic Papers 【 display / non-display

  • High-frequency linear friction welding of aluminum alloys to stainless steel, Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose, Journal of Materials Processing Technology,Vol.269, 45-51, 2019.07, Papers

  • Thermal fatigue properties of ultrasonic bonded copper joints, 26. Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Applied Sciences,9, 1556 (2019), 2019.04, Papers

  • Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Journal of Electronic Materials,Vol. 48, Issue 6, pp. 3699-3712, 2019.03, Papers

  • Evolution of transient liquid-phase sintered Cu–Sn skeleton microstructure during thermal aging, Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Applied Science,9(1) 157, 2019.01, Papers

  • Bonding through novel solder-metallic mesh composite design, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Materials & Design,Vol.160, pp.475-485, 2018.12, Papers

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Awards 【 display / non-display

  • Mate 2017 Excellent Paper Award, 2017.02

  • Excellent Poster Award for Young Scientist, Tomoki Matsuda, 9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9), 2016.08