School personnel information

写真b

MATSUDA Tomoki


Mail Address

Mail Address

URL

http://www.mapse.eng.osaka-u.ac.jp/w2/

Gender

Male

Organization 【 display / non-display

  • 2015.04.01 - , Division of Materials and Manufacturing Science, Graduate School of Engineering, Assistant Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 2011.03
Osaka University Graduate School, Division of Engineering  Completed 2013.03
Osaka University Graduate School, Division of Engineering  Completed 2015.03
 

Academic Papers 【 display / non-display

  • Influence of interfacial structure on the fracture behavior of friction stir spot welded dissimilar joints, Tomoki Matsuda, Kiriko Owada, Asahi Numata, Hiroto Shoji, Tomokazu Sano, Mitsuru Ohata, Akio Hirose, Materials Science and Engineering: A,Vol.772, 1387443, 2020.01, Papers

  • Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach, Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Applied Sciences,9(17), 3476, 2019.08, Papers

  • High-frequency linear friction welding of aluminum alloys to stainless steel, Tomoki Matsuda, Hironobu Adachi, Tomokazu Sano, Ryo Yoshida, Hisashi Hori, Shozo Ono, Akio Hirose, Journal of Materials Processing Technology,Vol.269, 45-51, 2019.07, Papers

  • Thermal fatigue properties of ultrasonic bonded copper joints, Takahito Fushimi, Yo Tanaka, Shinnosuke Soda, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Applied Sciences,9, 1556 (2019), 2019.04, Papers

  • Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints, Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose, Journal of Electronic Materials,Vol. 48, Issue 6, pp. 3699-3712, 2019.03, Papers

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Awards 【 display / non-display

  • Mate 2017 Excellent Paper Award, 2017.02

  • Excellent Poster Award for Young Scientist, Tomoki Matsuda, 9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9), 2016.08