School personnel information

写真b

Suetake Aiji


Organization 【 display / non-display

  • 2015.03.16 - , The Institute of Scientific and Industrial Research, Specially Appointed Researcher

 

Academic Papers 【 display / non-display

  • Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste, D. J. Kim, C. T. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara,and K. Suganuma,58 SBBD15, 2019.03, Papers

  • Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste, D. J. Kim, C. T. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara,and K. Suganuma,58 SBBD15, 2019.03, Papers

  • Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste, D. J. Kim, C. T. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara,and K. Suganuma,58 SBBD15, 2019.03, Papers

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma,The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

  • A novel joining process for the die attachment of next generation Power Devices, Hao Zhang、 Seungjun Noh、 Zhi-quan Liu、 Caifu Li、 Norio Asatani、Yukiharu Kimoto、 Aiji Suetake、Shijo Nagao、Tohru Sugahara、Katsuaki Suganuma,The Minerals, Metals & Materials Society (TMS) 2019 Annual Meeting & Exhibition, , 2019.03, Conference Report / Oral Presentation

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