School personnel information

写真b

KONDO Toshiyuki


Keyword

strength of materials, fatigue, micro/nano materials

URL

http://www-micro.mech.eng.osaka-u.ac.jp/home.html

Organization 【 display / non-display

  • 2014.04.01 - , Department of Mechanical Engineering, Graduate School of Engineering, Assistant Professor

Education 【 display / non-display

Osaka University Faculty of Engineering  Graduated 2007.03
Osaka University Graduate School, Division of Engineering  Completed 2009.03
Osaka University Graduate School, Division of Engineering  Completed 2014.03
 

Academic Papers 【 display / non-display

  • Influence of a thin surface oxide layer on fracture toughness of copper films, Toshiyuki Kondo, Daiki Miki, Hiroyuki Hirakata and Kohji Minoshima,International Conference on Advanced Technology in Experimental Mechanics 2019 (ATEM'19), 2019.10, International Conference(Proceedings)

  • Electron-beam enhanced creep deformation of amorphous silicon nano-cantilever, Hiroyuki Hirakata, Kenta Konishi, Toshiyuki Kondo, Kohji Minoshima, Journal of Applied Physics,126 105102-1-105102-10, 2019.09, Papers

  • Effects of surface oxide layer on fracture toughness of submicrometer-thick freestanding copper films, Toshiyuki Kondo, Daiki Miki, Hiroyuki Hirakata, Kohji Minoshima, Engineering Fracture Mechanics,220 106652-1-106652-9, 2019.08, Papers

  • Vacuum effects on fatigue crack growth in submicrometre-thick freestanding copper films, Toshiyuki Kondo, Akihiro Shin, Masaya Akasaka, Hiroyuki Hirakata, Kohji Minoshima, Fatigue & Fracture of Engineering Materials & Structures,42(5) 1118-1129, 2019.01, http://orcid.org/0000-0002-3450-4595, Papers

  • Fracture Toughness of 39-nm-Thick Freestanding Copper Films, Toshiyuki Kondo, Kazuki Hiramine, Hiroyuki Hirakata, Kohji Minoshima,Asia-Pacific Conference on Fracture and Strength; APCFS2018, 2018.10, International Conference(Non Proceeding)

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