School personnel information

写真b

Suga Tetsuo


Keyword

Welding consumables, Arc welding process

Mail Address

Mail Address

Laboratory Phone number

+81-6-6879-8647

Laboratory Fax number

+81-6-6879-8647

Gender

Male

Organization 【 display / non-display

  • 2013.07.01 - , Joining and Welding Research Institute, Specially Appointed Researcher

  • 2013.07.01 - , Joining and Welding Research Institute, Visiting Professor

Education 【 display / non-display

Nagoya Institute of Technology Graduate School, Division of Engineering  Completed 1974.03
Osaka University Graduate School, Division of Engineering  Completed 2001.05

Academic Society Membership 【 display / non-display

  • Japan Welding Society

 

Academic Papers 【 display / non-display

  • The Effect of Cold Cracking Prevention of FCAW by the Welding Process for Reducing Diffusible Hydrogen, Naoki MUKAI,Yoshihide INOUE,Shinichi TASHIRO,Tetsuo SUGA,Manabu TANAKA, Journal of Smart Processing,9, 1 (2020) 35-39., 2020.01, Papers(In Japanese)

  • Influence of shielding gas on cathode spot behaviours in alternating current tungsten inert gas welding of aluminium, Le Huy PHAN, Shinichi TASHIRO, Hanh Van BUI, Tetsuo SUGA, Toyoyuki SATO, Manabu TANAKA, Science and Technology of Welding and Joining,25, (2019) online., 2019.11, Papers

  • Numerical Simulation of Gas Flow in a Novel Torch for Reducing Diffusible Hydrogen, Shinichi TASHIRO, Naoki MUKAI, Yoshihide INOUE, Anthony B. MURPHY, Tetsuo SUGA and Manabu TANAKA, Journal of Smart Processing,8, 5 (2019) 219-224., 2019.09, Papers(In Japanese)

  • Laser welding for joining of open-cell aluminum foam to solid shell, Chakkrist PHONGPHISUTTHINAN, Paiboon WATTANAPORNPHAN, Tetsuo SUGA, Masami MIZUTANI, Seiji KATAYAMA, Welding in the world,63, 3 (2019) 825-839., 2019.05, Papers

  • Investigation on cathode spot behavior in argon AC TIG welding of aluminum through experimental observation, Le Huy PHAN, Shinichi TASHIRO, Hanh Van BUI, Tetsuo SUGA, Toyoyuki SATO, Manabu TANAKA, Journal of Physics D: Applied Physics,(2019) , 2019.04, Papers

display all >>